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MC33972DWB

NXP MC33972DWB

开关监控SPI 串行3.1V ~ 5.25V表面贴装型

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NXP USA Inc.
MC33972DWB
IC INTERFACE SPECIALIZED 32SOIC
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¥3.09

价格更新:一个月前

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产品详情

Overview

The 33972 Multiple Switch Detection Interface with suppressed wake-Up is designed to detect the closing and opening of up to 22 switch contacts. The switch status, either open or closed, is transferred to the microprocessor unit (MCU) through a serial peripheral interface (SPI). The device also features a 22-to-1 analog multiplexer for reading inputs as analog. The analog input signal is buffered and provided onthe AMUX output pin for the MCU to read. The 33972 device has two modes of operation, Normal and Sleep. Normal Mode allows programming of the device and supplies switch contacts with pull-up or pull-down current as it monitors switch change of state. The Sleep Mode provides low quiescent current, which makes the 33972 ideal for automotive and industrial products requiring low sleep-state currents. Features • Designed to operate 5.5V ≤ VPWR ≤ 26V  • Switch input voltage range -14V to VPWR, 40V Max • Interfaces directly to MPU using 3.3V/5.0V SPI protocol • Selectable wake-up on change of state • Selectable wetting current (16mA or 2.0mA) • 8 programmable inputs (switches to battery or ground) • 14 switch-to-ground inputs  • Typical standby current - VPWR = 100μA and VDD = 20μA  • Active interrupt (INT) on change-of-switch state • Pb-free packaging designated by suffix code EW • Exposed pad packaging designated by suffix code EK

Features

Tube Package
It is based on MC33972.

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC33972DWB Specialized Interface ICs applications.

  • Medical/Industrial
  • Imaging
  • Ultrasound
  • Audio and video switching
  • Automatic test equipment
  • Precision data acquisition
  • Battery-powered systems
  • Sample-and-hold systems
  • Communication systems
  • Data Acquisition Systems
产品属性
全选
包装: 管件
部件状态: 停产
使用案例: 开关监控
接口: SPI 串行
电源电压: 3.1V ~ 5.25V
封装/外壳: 32-BSSOP(0.295",7.50mm 宽)
供应商器件封装: 32-SOIC
安装类型: 表面贴装型
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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