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MC33887PNB

NXP MC33887PNB

驱动器 - 全集成,控制和功率级5A5V ~ 28V

比较
NXP USA Inc.
MC33887PNB
IC MOTOR DRIVER 5V-28V 36PQFN
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比较

¥16.56

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The 33887 is a monolithic H-Bridge Power IC with a load current feedback feature making it ideal for closed-loop DC motor control. The IC incorporates internal control logic, charge pump, gate drive, and low RDS(ON) MOSFET output circuitry. The 33887 is able to control inductive loads with continuous DC load currents up to 5.0 A, and with peak current active limiting between 5.2 A and 7.8 A. Output loads can be pulse width modulated (PWM-ed) at frequencies up to 10 kHz. The load current feedback feature provides a proportional (1/ 375th of the load current) constant-current output suitable for monitoring by a microcontroller’s A/D input. This feature facilitates the design of closed-loop torque/speed control as well as open load detection.

Features • Fully specified operation 5.0 V to 28 V • Limited operation with reduced performance up to 40 V • 120 mΩ RDS(ON) Typical H-Bridge MOSFETs • TTL/CMOS Compatible Inputs • PWM Frequencies up to 10 kHz • Active Current Limiting (Regulation) • Fault Status Reporting • Sleep Mode with Current Draw ≤50 μA (Inputs Floating or Set to Match Default Logic States)

Features

Tray Package
Applications : General Purpose
Load voltage across the chip 5V~28V
base on MC33887 number

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC33887PNB motor drivers applications.

  • Large outdoor LED display
  • Commercial office
  • Hospitality buildings
  • Smart lighting applications
  • Automotive applications
  • Dome
  • Dash
  • Footwell lighting
  • Indicator
  • Telltale lights
产品属性
全选
包装: 托盘
部件状态: 停产
电机类型 - AC,DC: 有刷直流
功能: 驱动器 - 全集成,控制和功率级
输出配置: 半桥(2)
接口: 并联
技术: 功率 MOSFET
使用案例: 通用
电流 - 输出: 5A
电源电压: 5V ~ 28V
负载电压: 5V ~ 28V
工作温度: -40°C ~ 150°C(TJ)
安装类型: 表面贴装型
封装/外壳: 36-PowerQFN
供应商器件封装: 36-PWR QFN(9x9)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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