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MC33794DH

NXP MC33794DH

传感器接口逻辑逻辑

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NXP USA Inc.
MC33794DH
IC SENSOR ELECTRIC FIELD 44-HSOP
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¥19.40

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The MC33790HEGR2 is IC DSI INTERFACE 2CH 16SOIC, that includes Distributed Systems Interface Type, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.014963 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 16-SOIC (0.295", 7.50mm Width), as well as the Logic Input Type, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Mounting Type is Surface Mount, the device is offered in Logic Output Type, the device has a SPI of Interface, and Supplier Device Package is 16-SOIC, and the Current Supply is 1mA, it has an Maximum Operating Temperature range of + 150 C, it has an Minimum Operating Temperature range of - 40 C.

The MC33793D is IC DSI SLAVE FOR R-SENSE 16-SOIC, that includes Logic Input Type, they are designed to operate with a Parallel Interface, Mounting Type is shown on datasheet note for use in a Surface Mount, it has an Operating Temperature range of -40°C ~ 150°C, Output Type is designed to work in Logic, as well as the 16-SOIC (0.154", 3.90mm Width) Package Case, the device can also be used as Tube Packaging. In addition, the Supplier Device Package is 16-SOIC, the device is offered in Distributed Systems Interface Type.

Features

Tube Package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC33794DH applications of sensor and detector interfaces.

  • Security system intrusion detection
  • Automatic doors
  • Engine Knock Detector Signal Processing
  • Analog Signal Processing With Filter Characteristics
  • Camshaft VRS Interfaces
  • Crankshaft VRS Interfaces
  • Vehicle Speed VRS Interfaces
  • Automatic Lighting (Residential and Commercial)
  • Automation of Doors
  • Motion Triggered Events (Animal photography)
产品属性
全选
包装: 管件
部件状态: 停产
可编程: 未验证
类型: 传感器接口
输入类型: 逻辑
输出类型: 逻辑
电流 - 供电: 7 mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 44-BSSOP(0.433",11.00mm 宽)裸露焊盘
供应商器件封装: 44-HSOP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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