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MC33395TEW

NXP MC33395TEW

半桥65.5V ~ 24V

比较
NXP USA Inc.
MC33395TEW
IC GATE DRVR HALF-BRIDGE 32SOIC
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¥35.35

价格更新:一个月前

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产品详情

Overview

The MC33395EWR2 is IC GATE DRIVER 3PHASE 32SOIC, that includes Half-Bridge Type, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a Surface Mount, it has an Operating Temperature range of 350ns, 250ns, Mounting Type is designed to work in -40°C ~ 150°C (TJ), as well as the 32-SOIC (0.295", 7.50mm Width) Supplier Device Package, the device can also be used as 6 Resolution Bits. In addition, the Data Interface is 3-Phase, the device is offered in Non-Inverting Voltage Supply Analog, the device has a of Number of ADCs DACs, and Sigma Delta is 5.5 V ~ 24 V.

The MC33395EW is IC GATE DRIVER 3PHASE 32SOIC, that includes 3-Phase Data Interface, they are designed to operate with a -40°C ~ 150°C (TJ) Mounting Type, Number of ADCs DACs is shown on datasheet note for use in a , it has an Operating Temperature range of 350ns, 250ns, Package Case is designed to work in Surface Mount, as well as the Tube Packaging, the device can also be used as 6 Resolution Bits. In addition, the Sigma Delta is 5.5 V ~ 24 V, the device is offered in 32-SOIC (0.295", 7.50mm Width) Supplier Device Package, the device has a Half-Bridge of Type, and Voltage Supply Analog is Non-Inverting.

Features

Tube Package
Embedded in the Tube package
6 drivers
Employing a gate type of N-Channel MOSFET

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC33395TEW gate drivers applications.

  • Line drivers
  • Portable computers
  • High-speed communications
  • RGB applications
  • Broadcast equipment
  • Active filtering
  • Head-up and Head mounted displays
  • High current laser/LED systems
  • LCD/LCoS/DLP portable and embedded pico projectors
  • Multicolor LED/laser displays
产品属性
全选
包装: 管件
部件状态: 停产
可编程: 未验证
驱动配置: 半桥
通道类型: 3 相
驱动器数: 6
栅极类型: N 沟道 MOSFET
电源电压: 5.5V ~ 24V
输入类型: 非反相
上升/下降时间(典型值): 350ns,250ns
工作温度: -40°C ~ 150°C(TJ)
安装类型: 表面贴装型
封装/外壳: 32-BSSOP(0.295",7.50mm 宽)
供应商器件封装: 32-SOIC
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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