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MC14489BDWER2

NXP MC14489BDWER2

LED7 段显示串行

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NXP USA Inc.
MC14489BDWER2
IC DRVR 7 SEGMENT 20SOIC
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¥43.20

价格更新:一个月前

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产品详情

Overview

The MC14489BDWE is IC DRIVER LED/LAMP 5CH 20-SOIC, that includes MC14489B Series, they are designed to operate with a Tube Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.018325 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 20-SOIC (0.295", 7.50mm Width), it has an Operating Temperature range of -40°C ~ 130°C, the device can also be used as Surface Mount Mounting Type. In addition, the Interface is Serial, the device is offered in 4.5 V ~ 5.5 V Voltage Supply, the device has a 20-SOIC of Supplier Device Package, and Configuration is 7 Segment, and the Current Supply is 5.5mA, and Display Type is LED, it has an Maximum Operating Temperature range of + 130 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 4.5 V to 5.5 V, and Supply Current Max is 1.5 mA, and the High Level Output Current is 17.5 mA, and Low Level Output Current is 0.2 mA, and the Number of Segments is 40, and Number of Digits is 5.

MC14489AP with circuit diagram manufactured by MOTOROLA. The MC14489AP is available in DIP Package, is part of the IC Chips.

Features

Tape & Reel (TR) Package
20-SOIC (0.295, 7.50mm Width) package
MC14489 family

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC14489BDWER2 display drivers applications.

  • Relay Driver
  • Digital Clock, Thermometer, Counter, Voltmeter
  • Instrumentation Readouts
  • Instrumentation
  • Test Equipment
  • Hand Held Instruments
  • Bargraph Dlsplays
  • Numerlc and Non-Numerlc Panel Dlsplays
  • High and Low Temperature Envlronment s where LCD
  • Dlsplay Integrtty ls Compromissd
产品属性
全选
包装: 卷带(TR)
部件状态: 不适用于新设计
显示类型: LED
配置: 7 段显示
接口: 串行
电流 - 供电: 5.5 mA
电源电压: 4.5V ~ 5.5V
工作温度: -40°C ~ 130°C
安装类型: 表面贴装型
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商器件封装: 20-SOIC
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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