NXP MC100ES6011D

扇出缓冲器（分配）11：2

Overview

The MC100EPT622FAR2G is IC XLATOR LVTTL/CMOS-PECL 32LQFP, that includes 100EPT Series, they are designed to operate with a LVCMOS/LVTTL to LVPECL Type, Packaging is shown on datasheet note for use in a Tape & Reel (TR) Alternate Packaging, that offers Unit Weight features such as 0.027302 oz, Mounting Style is designed to work in SMD/SMT, as well as the 32-LQFP Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Mounting Type is Surface Mount, the device is offered in Non-Inverted Output Type, the device has a 32-LQFP (7x7) of Supplier Device Package, and Number of Circuits is 1, and the Logic Type is Translator, and Translator Type is Mixed Signal, and the Channel Type is Unidirectional, and Channels per Circuit is 10, and the Input Signal is LVCMOS, LVTTL, and Output Signal is LVPECL, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Supply Voltage Max is 3.8 V, and Supply Voltage Min is 3 V, and the Logic Family is ECL, and Propagation Delay Time is 0.875 ns.

The MC100EPT622MNR4G is IC XLATOR LVTTL/CMOS-PECL 32-QFN, that includes 10 Channels per Circuit, they are designed to operate with a Unidirectional Channel Type, Input Signal is shown on datasheet note for use in a LVCMOS, LVTTL, that offers Mounting Type features such as Surface Mount, Number of Circuits is designed to work in 1, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as LVPECL Output Signal. In addition, the Output Type is Non-Inverted, the device is offered in 32-VFQFN Exposed Pad Package Case, the device has a Tape & Reel (TR) of Packaging, and Series is 100EPT, and the Supplier Device Package is 32-QFN (5x5), and Translator Type is Mixed Signal.

Features

100ES Series
The operating temperature of -40°C~85°C degrees

Surface Mount Mounting Type

Applications

There are a lot of NXP USA Inc.
MC100ES6011D Clock Buffers & Drivers applications.

• High performance communication system
• Data center
• Cloud computing
• Network
• High speed industry
• High-end consumer electronics
• Data communication
• Telecommunications
• Computing
• Medical imaging