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MBC13917EPR2

NXP MBC13917EPR2

100MHz ~ 2.5GHz3.5dBm24dB1.19dB2.1V ~ 3.3V

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NXP USA Inc.
MBC13917EPR2
IC AMP GPS 100MHZ-2.5GHZ 6MLPD
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¥3.56

价格更新:一个月前

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产品详情

Overview

The MBC13916NT1 is TRANS RF NPN LO NOISE SOT-343, that includes MBC13916 Series, they are designed to operate with a General Purpose Amplifier Type, Packaging is shown on datasheet note for use in a Digi-ReelR Alternate Packaging, that offers Unit Weight features such as 0.000226 oz, Mounting Style is designed to work in SMD/SMT, as well as the SC-82A, SOT-343 Package Case, the device can also be used as 100MHz ~ 2.5GHz Frequency. In addition, the Number of Channels is 1 Channel, the device is offered in 2.7 V ~ 5 V Voltage Supply, the device has a SOT-343R of Supplier Device Package, and Current Supply is 20mA, and the Gain is 16.5dB, and Test Frequency is 1.9GHz, and the P1dB is 2.5dBm (1.8mW), and Noise Figure is 1.9dB, and the RF Type is General Purpose, and Pd Power Dissipation is 100 mW, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 2.7 V, and Operating Supply Current is 4.7 mA, and the Operating Frequency is 100 MHz to 2.5 GHz, and NF Noise Figure is 0.9 dB, and the P1dB Compression Point is 2.5 dBm, and OIP3 Third Order Intercept is 13 dBm, and the Isolation dB is 28 dB.

MBC13916T1G with circuit diagram manufactured by ON. The MBC13916T1G is available in SOT-343R Package, is part of the IC Chips.

Features

Bulk Package
WIDE BAND LOW POWER RF/Microwave Amplifier
RF Type General Purpose
2.1V~3.3V voltage
20mA current

900MHz Test Frequency

Applications


There are a lot of NXP USA Inc.
MBC13917EPR2 RF Amplifiers applications.

  • Marine Navigation
  • Avionics
  • GPS
  • GLONASS
  • BeiDou
  • Galileo
  • Wireless communications
  • ISM applications
  • Wireless infrastructure
  • Automated test equipment
产品属性
全选
包装: 散装
部件状态: 在售
频率: 100MHz ~ 2.5GHz
P1dB: 3.5dBm
增益: 24dB
噪声系数: 1.19dB
射频类型: 通用
电源电压: 2.1V ~ 3.3V
电流 - 供电: 20mA
测试频率: 900MHz
封装/外壳: 6-UFDFN 裸露焊盘
供应商器件封装: 6-MLPD(1.5x2)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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