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LPC55S66JBD100K

NXP LPC55S66JBD100K

ARM® Cortex®-M33150MHz256KB(256K x 8)

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NXP USA Inc.
LPC55S66JBD100K
IC MCU 32BIT 256KB FLSH 100HLQFP
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¥29.10

价格更新:2025-03-17

博斯克质量保证

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产品详情

Overview

The LPC55S66JBD100K MCU family builds on the world’s first general-purpose Cortex-M33 based microcontroller introduced with the LPC5500 series. This high-efficiency family leverages the new Armv8-M architecture to introduce new levels of performance and advanced security capabilities including TrustZone-M and co-processor extensions. The LPC55S66JBD100K family enables these co-processors extensions and leverages them to bring significant signal processing efficiency gains from a proprietary DSP accelerator offering a 10x clock cycle reduction. An optional second Cortex-M33 core offers flexibility to balance high performance and power efficiency.

In addition, the LPC55S66JBD100K MCU family provides benefits from 40nm NVM based process technology cost advantages, broad scalable packages, and memory options, as well as a robust enablement including MCUXpresso Software and Tools ecosystem and low-cost development boards.

Features

LPC55S6x Series


  • Running at a maximum CPU frequency of 150 MHz (device revision 1B only).

  • Memory Protection Unit, Floating Point Unit (FPU), and TrustZone? (MPU).

  • Built-in Nested Vectored Interrupt Controller for the ARM Cortex M33 (NVIC).

  • NMI input with a choice of sources that is non-maskable.

  • Eight breakpoints and four watch points for serial wire debugging. Contains Serial

  • For improved debugging capabilities, use Wire Output.



Surface Mount Mounting Type

Applications


Switching applications


产品属性
全选
型号系列: LPC55S6x
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M33
内核规格: 32 位单核
速度: 150MHz
连接能力: Flexcomm,I²C,MMC/SD/SDIO,SPI,UART/USART,USB
外设: 欠压检测/复位,DMA,I²S,POR,PWM,WDT
输入/输出数量: 64
程序存储容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 大小: 144K x 8
电源电压(Vcc/Vdd): 1.8V ~ 3.6V
数据转换器: A/D 10x16b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 100-LQFP 裸露焊盘
供应商器件封装: 100-HLQFP(14x14)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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