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LPC2132FBD64/01151

NXP LPC2132FBD64/01151

ARM7®60MHz64KB(64K x 8)

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NXP USA Inc.
LPC2132FBD64/01151
IC MCU 16/32BIT 64KB FLSH 64LQFP
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¥15.05

价格更新:一个月前

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产品详情

Overview

The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit Arm7TDMI-S™CPU with real-time emulation and embedded trace support, that combine the microcontroller with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.

Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low-end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.

Features

LPC2100 Series
Bulk Package
ARM7® Core Processor
60MHz Speed
I²C, Microwire, SPI, SSI, SSP, UART/USART Connectivity
47 Number of I/O
64KB (64K x 8) Program Memory Size
FLASH Program Memory Type
16K x 8 RAM Size
3V ~ 3.6V Voltage - Supply (Vcc/Vdd)
A/D 8x10b; D/A 1x10b Data Converters
Internal Oscillator Type
Surface Mount Mounting Type
产品属性
全选
型号系列: LPC2100
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: ARM7®
内核规格: 16/32-位
速度: 60MHz
连接能力: I²C,Microwire,SPI,SSI,SSP,UART/USART
外设: 欠压检测/复位,POR,PWM,WDT
输入/输出数量: 47
程序存储容量: 64KB(64K x 8)
程序存储器类型: 闪存
RAM 大小: 16K x 8
电源电压(Vcc/Vdd): 3V ~ 3.6V
数据转换器: A/D 8x10b;D/A 1x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 64-LQFP
供应商器件封装: 64-LQFP(10x10)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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