联系我们
中文
LPC1758FBD80Y

NXP LPC1758FBD80Y

ARM® Cortex®-M3100MHz512KB(512K x 8)

比较
NXP USA Inc.
LPC1758FBD80Y
IC MCU 32BIT 512KB FLASH 80LQFP
paypalvisamastercarddiscover
upsdhlsf
比较

¥51.52

价格更新:2025-03-14

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

■ ARM Cortex-M3 processor, running at frequencies of up to 100 MHz (LPC1758/56/57/54/52/51) or of up to 120 MHz (LPC1759). A Memory Protection Unit (MPU) supporting eight regions is included. ■ ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC). ■ Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 120 MHz operation with zero wait states. ■ In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. ■ On-chip SRAM includes: ♦ Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance CPU access. ♦ Two/one 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet (LPC1758 only), USB, and DMA memory, as well as for general purpose CPU instruction and data storage. ■ Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I2S-bus, UART, the Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers. ■ Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC (LPC1758 only), and the USB interface. This interconnect provides communication with no arbitration delays. ■ Split APB bus allows high throughput with few stalls between the CPU and DMA. ■ Serial interfaces: ♦ On the LPC1758 only, Ethernet MAC with RMII interface and dedicated DMA controller. ♦ USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and on-chip PHY for device, Host, and OTG functions. The LPC1752/51 include a USB device controller only. ♦ Four UARTs with fractional baud rate generation, internal FIFO, and DMA support. One UART has modem control I/O and RS-485/EIA-485 support, and one UART has IrDA support. ♦ CAN 2.0B controller with two (LPC1759/58/56) or one (LPC1754/52/51) channels. ♦ SPI controller with synchronous, serial, full duplex communication and programmable data length. ♦ Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces can be used with the GPDMA controller. ♦ Two I2C-bus interfaces supporting fast mode with a data rate of 400 kbit/s with multiple address recognition and monitor mode. ♦ On the LPC1759/58/56 only, I2S (Inter-IC Sound) interface for digital audio input or output, with fractional rate control. The I2S-bus interface can be used with the GPDMA. The I2S-bus interface supports 3-wire and 4-wire data transmit and receive as well as master clock input/output. ■ Other peripherals: ♦ 52 General Purpose I/O (GPIO) pins with configurable pull-up/down resistors. All GPIOs support a new, configurable open-drain operating mode. The GPIO block is accessed through the AHB multilayer bus for fast access and located in memory such that it supports Cortex-M3 bit banding and use by the General Purpose DMA Controller. ♦ 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among six pins, conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can be used with the GPDMA controller. ♦ On the LPC1759/58/56/54 only, 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA support. ♦ Four general purpose timers/counters, with a total of three capture inputs and ten compare outputs. Each timer block has an external count input. Specific timer events can be selected to generate DMA requests. ♦ One motor control PWM with support for three-phase motor control. ♦ Quadrature encoder interface that can monitor one external quadrature encoder. ♦ One standard PWM/timer block with external count input. ♦ Real-Time Clock (RTC) with a separate power domain and dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered backup registers. ♦ Watchdog Timer (WDT). The WDT can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock. ♦ ARM Cortex-M3 system tick timer, including an external clock input option. ♦ Repetitive Interrupt Timer (RIT) provides programmable and repeating timed interrupts. ♦ Each peripheral has its own clock divider for further power savings. ■ Standard JTAG test/debug interface for compatibility with existing tools. Serial Wire Debug and Serial Wire Trace Port options. ■ Emulation trace module enables non-intrusive, high-speed real-time tracing of instruction execution. ■ Integrated PMU (Power Management Unit) automatically adjusts internal regulators to minimize power consumption during Sleep, Deep sleep, Power-down, and Deep power-down modes. ■ Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down. ■ Single 3.3 V power supply (2.4 V to 3.6 V). ■ One external interrupt input configurable as edge/level sensitive. All pins on Port 0 and Port 2 can be used as edge sensitive interrupt sources. ■ Non-maskable Interrupt (NMI) input. ■ The Wakeup Interrupt Controller (WIC) allows the CPU to automatically wake up from any priority interrupt that can occur while the clocks are stopped in Deep sleep, Power-down, and Deep power-down modes. ■ Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt (LPC1758 only), CAN bus activity, Port 0/2 pin interrupt, and NMI). ■ Brownout detect with separate threshold for interrupt and forced reset. ■ Power-On Reset (POR). ■ Crystal oscillator with an operating range of 1 MHz to 25 MHz. ■ 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a system clock. ■ PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the RTC oscillator. ■ USB PLL for added flexibility. ■ Code Read Protection (CRP) with different security levels. ■ Unique device serial number for identification purposes. ■ Available as 80-pin LQFP package (12 mm × 12 mm × 1.4 mm).

Features

LPC17xx Series


  • ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).

  • Split APB bus allows high throughput with few stalls between the CPU and DMA

  • In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.

  • Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 120 MHz operation with zero wait states.

  • ARM Cortex-M3 processor, running at frequencies of up to 100 MHz (LPC1758/56/57/54/52/51) or of up to 120 MHz (LPC1759). A Memory Protection Unit (MPU) supporting eight regions is included.

  • On-chip SRAM includes:

    Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance CPU access.

    Two/one 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet (LPC1758 only), USB, and DMA memory, as well as for general purpose CPU instruction and data storage.

  • Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I2S-bus, UART, the Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers.

  • Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC (LPC1758 only), and the USB interface. This interconnect provides communication with no arbitration delays.



Surface Mount Mounting Type

Applications


  • Automotive 

  • Personal electronics

  • Communications equipment


产品属性
全选
型号系列: LPC17xx
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M3
内核规格: 32 位单核
速度: 100MHz
连接能力: CANbus,以太网,I²C,IrDA,Microwire,SPI,SSI,UART/USART,USB OTG
外设: 欠压检测/复位,DMA,I²S,电机控制 PWM,POR,PWM,WDT
输入/输出数量: 52
程序存储容量: 512KB(512K x 8)
程序存储器类型: 闪存
RAM 大小: 64K x 8
电源电压(Vcc/Vdd): 2.4V ~ 3.6V
数据转换器: A/D 6x12b; D/A 1x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 80-LQFP
供应商器件封装: 80-LQFP(12x12)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z