
NXP LPC11U37FBD48/401,
ARM® Cortex®-M050MHz128KB(128K x 8)
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Overview
LPC11U36FBD64/401, with pin details, that includes LPC11Uxx Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 64-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 64-LQFP (10x10), as well as the 54 Number of I O, the device can also be used as 50MHz Speed. In addition, the EEPROM Size is 4K x 8, the device is offered in ARMR CortexR-M0 Core Processor, the device has a 10K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is Brown-out Detect/Reset, POR, WDT, and Connectivity is I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB, and the Voltage Supply Vcc Vdd is 1.8 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 96KB (96K x 8), and Data Converters is A/D 8x10b, and the Oscillator Type is Internal.
LPC11U35FHN33/40155 with circuit diagram manufactured by NXP. The LPC11U35FHN33/40155 is available in 32-HVQFN Package, is part of the IC Chips.
Features
LPC11U3x SeriesBulk Package
50MHz Speed
I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Connectivity
40 Number of I/O
128KB (128K x 8) Program Memory Size
FLASH Program Memory Type
4K x 8 EEPROM Size
10K x 8 RAM Size
1.8V ~ 3.6V Voltage - Supply (Vcc/Vdd)
A/D 8x10b SAR Data Converters
External, Internal Oscillator Type
Surface Mount Mounting Type
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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