联系我们
中文
LPC1113FBD48/303,1

NXP LPC1113FBD48/303,1

ARM® Cortex®-M050MHz24KB(24K x 8)

比较
NXP USA Inc.
LPC1113FBD48/303,1
IC MCU 32BIT 24KB FLASH 48LQFP
paypalvisamastercarddiscover
upsdhlsf
比较

面议

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The LPC1113FBD48/302,1 is IC MCU 32BIT 24KB FLASH 48LQFP, that includes LPC1100L Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 48-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 48-LQFP (7x7), as well as the 42 Number of I O, the device can also be used as 50MHz Speed. In addition, the Core Processor is ARMR CortexR-M0, the device is offered in 8K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is Brown-out Detect/Reset, POR, WDT, and the Connectivity is I2C, SPI, UART/USART, and Voltage Supply Vcc Vdd is 1.8 V ~ 3.6 V, and the Core Size is 32-Bit, and Program Memory Size is 24KB (24K x 8), and the Data Converters is A/D 8x10b, and Oscillator Type is Internal.

The LPC1113FBD48/302+151 is IC MCU ARM 24KB FLASH 48LQFP manufactured by NXP. The LPC1113FBD48/302+151 is available in 48-LQFP Package, is part of the Embedded - Microcontrollers, , and with support for IC MCU ARM 24KB FLASH 48LQFP.

Features

LPC1100XL Series
Bulk Package
50MHz Speed
I²C, SPI, UART/USART Connectivity
42 Number of I/O
24KB (24K x 8) Program Memory Size
FLASH Program Memory Type
8K x 8 RAM Size
1.8V ~ 3.6V Voltage - Supply (Vcc/Vdd)
A/D 8x10b Data Converters
Internal Oscillator Type
Surface Mount Mounting Type
产品属性
全选
型号系列: LPC1100XL
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M0
内核规格: 32 位单核
速度: 50MHz
连接能力: I²C,SPI,UART/USART
外设: 欠压检测/复位,POR,WDT
输入/输出数量: 42
程序存储容量: 24KB(24K x 8)
程序存储器类型: 闪存
RAM 大小: 8K x 8
电源电压(Vcc/Vdd): 1.8V ~ 3.6V
数据转换器: A/D 8x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 48-LQFP
供应商器件封装: 48-LQFP(7x7)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z