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KMPC8313CVRAGDB

NXP KMPC8313CVRAGDB

PowerPC e300c3400MHzDDR,DDR210/100/1000Mbps(2)-40°C ~ 105°C(TA)

比较
NXP USA Inc.
KMPC8313CVRAGDB
IC MPU MPC83XX 400MHZ 516TEPBGA
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¥23.75

价格更新:一个月前

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产品详情

Overview

The KMPC8280ZUUPEA is IC MPU MPC82XX 450MHZ 408TBGA, that includes MPC82xx Series, they are designed to operate with a Tray Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 480-LBGA, it has an Operating Temperature range of 0°C ~ 105°C (TA), Supplier Device Package is designed to work in 408-TBGA (37.5x37.5), as well as the 3.3V Voltage I O, the device can also be used as 450MHz Speed. In addition, the Core Processor is PowerPC G2_LE, the device is offered in 1 Core, 32-Bit Number of Cores Bus Width, the device has a Communications; RISC CPM of Co Processors DSP, and RAM Controllers is DRAM, SDRAM, and the Graphics Acceleration is No, and Ethernet is 10/100 Mbps (3), and the USB is USB 2.0 (1).

The KMPC8313CVRAFFB is IC MPU MPC83XX 333MHZ 516BGA, that includes PowerPC e300c3 Core Processor, they are designed to operate with a 10/100/1000 Mbps (2) Ethernet, Graphics Acceleration is shown on datasheet note for use in a No, that offers Number of Cores Bus Width features such as 1 Core, 32-Bit, it has an Operating Temperature range of -40°C ~ 105°C (TA), as well as the 516-BBGA Exposed Pad Package Case, the device can also be used as Tray Packaging. In addition, the RAM Controllers is DDR, DDR2, the device is offered in MPC83xx Series, the device has a 333MHz of Speed, and Supplier Device Package is 516-TEPBGA (27x27), and the USB is USB 2.0 + PHY (1), and Voltage I O is 1.8V, 2.5V, 3.3V.

Features

MPC83xx Series
PowerPC e300c3 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
KMPC8313CVRAGDB Microprocessor applications.

  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
产品属性
全选
型号系列: MPC83xx
包装: 散装
部件状态: 在售
核心处理器: PowerPC e300c3
每总线宽度内核数: 1 核,32 位
速度: 400MHz
RAM 控制器: DDR,DDR2
图形加速: 无
以太网: 10/100/1000Mbps(2)
USB(通用串行总线): USB 2.0 + PHY(1)
输入/输出电压: 1.8V,2.5V,3.3V
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 516-BBGA 裸露焊盘
供应商器件封装: 516-TEPBGA(27x27)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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