
NXP KMC908AB32MFU
HC088MHz32KB(32K x 8)
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Overview
The MC908AB32CFUE is IC MCU 8BIT 32KB FLASH 64QFP, that includes HC08 Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray Alternate Packaging, that offers Unit Weight features such as 0.032156 oz, Mounting Style is designed to work in SMD/SMT, as well as the 64-QFP Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Supplier Device Package is 64-QFP (14x14), the device is offered in 51 Number of I O, the device has a 8MHz of Speed, and EEPROM Size is 512 x 8, and the Core Processor is HC08, and RAM Size is 1K x 8, and the Program Memory Type is FLASH, and Peripherals is POR, PWM, and the Connectivity is SCI, SPI, and Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V, and the Core Size is 8-Bit, and Program Memory Size is 32KB (32K x 8), and the Data Converters is A/D 8x8b, and Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 4.5 V to 5.5 V, and Interface Type is SCI SPI, and the Core is HC08, and Processor Series is M68HC08, and the Data Bus Width is 8 bit, and Supply Voltage Max is 5.5 V, and the Supply Voltage Min is 2.7 V, and Maximum Clock Frequency is 8 MHz, and the Number of ADC Channels is 8, and Number of I Os is 33 I/O, and the Data RAM Size is 1 kB, and Number of Timers Counters is 4 Timer, and the ADC Resolution is 8 bit.
MC908AB32CFU with circuit diagram manufactured by FREESCALE. The MC908AB32CFU is available in QFP64 Package, is part of the IC Chips.
Features
HC08 SeriesBulk Package
HC08 Core Processor
8MHz Speed
SCI, SPI Connectivity
POR, PWM Peripherals
51 Number of I/O
32KB (32K x 8) Program Memory Size
FLASH Program Memory Type
512 x 8 EEPROM Size
1K x 8 RAM Size
4.5V ~ 5.5V Voltage - Supply (Vcc/Vdd)
A/D 8x8b Data Converters
Internal Oscillator Type
Surface Mount Mounting Type
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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博斯克数字
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