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KMC7448THX1400ND

NXP KMC7448THX1400ND

PowerPC G41.4GHz-40°C ~ 105°C(TA)

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NXP USA Inc.
KMC7448THX1400ND
IC MPU MPC74XX 1.4GHZ 360FCCBGA
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¥4892.05

价格更新:一个月前

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产品详情

Overview

The KMC7448HX1400ND is IC MPU MPC74XX 1.4GHZ 360FCCBGA, that includes MPC74xx Series, they are designed to operate with a Tray Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 360-BCBGA, FCCBGA, it has an Operating Temperature range of 0°C ~ 105°C (TA), Supplier Device Package is designed to work in 360-FCCBGA (25x25), as well as the 1.5V, 1.8V, 2.5V Voltage I O, the device can also be used as 1.4GHz Speed. In addition, the Core Processor is PowerPC G4, the device is offered in 1 Core, 32-Bit Number of Cores Bus Width, the device has a Multimedia; SIMD of Co Processors DSP, and Graphics Acceleration is No.

The KMC7448HX1700LC is IC MPU MPC74XX 1.7GHZ 360FCCBGA, that includes Multimedia; SIMD Co Processors DSP, they are designed to operate with a PowerPC G4 Core Processor, Graphics Acceleration is shown on datasheet note for use in a No, that offers Number of Cores Bus Width features such as 1 Core, 32-Bit, it has an Operating Temperature range of 0°C ~ 105°C (TA), as well as the 360-BCBGA, FCCBGA Package Case, the device can also be used as Tray Packaging. In addition, the Series is MPC74xx, the device is offered in 1.7GHz Speed, the device has a 360-FCCBGA (25x25) of Supplier Device Package, and Voltage I O is 1.5V, 1.8V, 2.5V.

Features

MPC74xx Series
PowerPC G4 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
KMC7448THX1400ND Microprocessor applications.

  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
产品属性
全选
型号系列: MPC74xx
包装: 散装
部件状态: 在售
核心处理器: PowerPC G4
每总线宽度内核数: 1 核,32 位
速度: 1.4GHz
协处理器/数字信号处理器(DSP): 多媒体;SIMD
图形加速: 无
输入/输出电压: 1.5V,1.8V,2.5V
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 360-BCBGA,FCCBGA
供应商器件封装: 360-FCCBGA(25x25)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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