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J177,126

NXP J177,126

30 V300 OhmsTO-226-3,TO-92-3(TO-226AA)成形引线

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NXP USA Inc.
J177,126
JFET P-CH 30V TO92-3
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产品详情

Overview

The J177 is JFET P-CH 30V 0.35W TO92, that includes Bulk Packaging, they are designed to operate with a 0.016000 oz Unit Weight, Mounting Style is shown on datasheet note for use in a Through Hole, that offers Package Case features such as TO-226-3, TO-92-3 (TO-226AA), Technology is designed to work in Si, as well as the Through Hole Mounting Type, the device can also be used as TO-92-3 Supplier Device Package. In addition, the Configuration is Single, the device is offered in P-Channel FET Type, the device has a 350mW of Power Max, and Voltage Breakdown V BRGSS is 30V, and the Current Drain Idss Vds Vgs=0 is 1.5mA @ 15V, and Voltage Cutoff VGS off Id is 800mV @ 10nA, and the Resistance RDS On is 300 Ohm, and Pd Power Dissipation is 360 mW, and the Id Continuous Drain Current is - 10 nA, and Vds Drain Source Breakdown Voltage is - 15 V, and the Rds On Drain Source Resistance is 250 Ohms, and Transistor Polarity is P-Channel, and the Vgs Gate Source Breakdown Voltage is 30 V, and Gate Source Cutoff Voltage is 2.25 V.

J176-TR with circuit diagram manufactured by SI. The J176-TR is available in TO-92 Package, is part of the JFETs (Junction Field Effect).

Features

Tape & Box (TB) Package
30 V Voltage - Breakdown (V(BR)GSS)
30 V Drain to Source Voltage (Vdss)
1.5 mA @ 15 V Current - Drain (Idss) @ Vds (Vgs=0)
800 mV @ 10 nA Voltage - Cutoff (VGS off) @ Id
8pF @ 10V (VGS) Input Capacitance (Ciss) (Max) @ Vds
300 Ohms Resistance - RDS(On)
400 mW Power - Max
150°C (TJ) Operating Temperature
Through Hole Mounting Type
产品属性
全选
包装: 带盒(TB)
部件状态: 停产
FET 类型: P 通道
击穿电压(栅极-源极-源极): 30 V
漏源电压(Vdss): 30 V
不同 Vds (Vgs=0) 时电流 - 漏极 (Idss): 1.5 mA @ 15 V
栅极-源极关态电压和漏极电流时的截止电压: 800 mV @ 10 nA
Vds 时的最大输入电容 (Ciss): 8pF @ 10V(VGS)
国内抵制: 300 Ohms
最大功率: 400 mW
工作温度: 150°C(TJ)
安装类型: 通孔
封装/外壳: TO-226-3,TO-92-3(TO-226AA)成形引线
供应商器件封装: TO-92-3
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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