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FXLS93433AESR2

NXP FXLS93433AESR2

I²C,SPI-40°C ~ 125°C

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NXP USA Inc.
FXLS93433AESR2
PSI5 XZ DUAL-AXIS HIGH-G INERTI
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¥23.92

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The 34333C is FIXED IND 33UH 480MA 560 MOHM, that includes 3400 Series, they are designed to operate with a Power Inductors Product, Type is shown on datasheet note for use in a Wirewound, that offers Packaging features such as Tape & Reel (TR), Current Rating is designed to work in 480mA, as well as the SMD/SMT Termination Style, it has an Operating Temperature Range range of - 40 C to + 125 C. In addition, the Height is 2 mm, the device is offered in 5.2 mm Length, the device has a 5.2 mm of Width, and Package Case is Nonstandard, it has an Operating Temperature range of -40°C ~ 125°C, and Mounting Type is Surface Mount, and the Size Dimension is 0.205" L x 0.205" W (5.20mm x 5.20mm), and Tolerance is ±20%, and the Height Seated Max is 0.079" (2.00mm), and Shielding is Shielded, and the Inductance is 33μH, and DC Resistance DCR is 560 mOhm Max, and the Maximum DC Current is 480 mA, and Maximum DC Resistance is 560 mOhms.

The 3433-3005 is CONN HEADER 50POS R/A GOLD T/H, that includes Black Color, they are designed to operate with a Header, Shrouded Connector Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as 30μin (0.76μm), Contact Mating Length is designed to work in 0.240" (6.10mm), as well as the Male Pin Contact Type, the device can also be used as Mounting Flange Features. In addition, the Mounting Type is Through Hole, Right Angle, the device is offered in 50 Number of Positions, the device has a All of Number of Positions Loaded, and Number of Rows is 2, and the Packaging is Bulk, and Pitch is 0.100" (2.54mm), and the Row Spacing is 0.100" (2.54mm), and Series is 3000, and the Termination is Wire Wrap.

Features

Tape & Reel (TR) Package
I²C, SPI Output Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
输出类型: I²C,SPI
工作温度: -40°C ~ 125°C
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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收入: 85M

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配件发货: 25M+

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