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DSPB56374AF

NXP DSPB56374AF

오디오 프로세서主机接口,I²C,SAI,SPI150MHz54kB0°C ~ 70°C(TA)

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NXP USA Inc.
DSPB56374AF
DIGITAL SIGNAL PROCESSOR, 24-BIT
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¥76.20

价格更新:一个月前

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产品详情

Overview

The DSPB56371AF180 is IC DSP 24BIT 180MHZ 80-LQFP, that includes DSP56K/Symphony Series, they are designed to operate with a Audio Processor Type, Packaging is shown on datasheet note for use in a Tray, that offers Package Case features such as 80-LQFP, it has an Operating Temperature range of 0°C ~ 70°C (TA), as well as the Surface Mount Mounting Type, the device can also be used as Host Interface, I2C, SAI, SPI Interface. In addition, the Supplier Device Package is 80-LQFP (14x14), the device is offered in 180MHz Clock Rate, the device has a ROM (384 kB) of Non Volatile Memory, and On Chip RAM is 264kB, and the Voltage I O is 3.30V, and Voltage Core is 1.25V.

The DSPB56374AE is IC DSP 24BIT 150MHZ 52-LQFP, that includes 150MHz Clock Rate, they are designed to operate with a Host Interface, I2C, SAI, SPI Interface, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Non Volatile Memory features such as ROM (84 kB), On Chip RAM is designed to work in 54kB, it has an Operating Temperature range of 0°C ~ 70°C (TA), the device can also be used as 52-LQFP Package Case. In addition, the Packaging is Tray, the device is offered in DSP56K/Symphony Series, the device has a 52-LQFP (10x10) of Supplier Device Package, and Type is Audio Processor, and the Voltage Core is 1.25V, and Voltage I O is 3.30V.

Features

DSP56K/Symphony Series
Supplied in the 80-LQFP package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
DSPB56374AF DSP applications.

  • Speech processing
  • Radar
  • Seismology
  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
产品属性
全选
型号系列: DSP56K/Symphony
包装: 托盘
部件状态: 停产
类型: 오디오 프로세서
接口: 主机接口,I²C,SAI,SPI
时钟速率: 150MHz
非易失性存储器: ROM(84kB)
片载 RAM: 54kB
输入/输出电压: 3.30V
核心电压: 1.25V
工作温度: 0°C ~ 70°C(TA)
安装类型: 表面贴装型
封装/外壳: 80-LQFP
供应商器件封装: 80-LQFP(14x14)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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