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DSPB56371AF150

NXP DSPB56371AF150

오디오 프로세서主机接口,I²C,SAI,SPI150MHz264kB0°C ~ 70°C(TA)

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NXP USA Inc.
DSPB56371AF150
DSP, 24 BIT SIZE, CMOS, PQFP80
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¥196.95

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

Targeted at audio/video (AV) receivers, home theaters, surround sound decoders, mini stereo systems, digital TV audio systems and automotive audio systems, the DSPB56371AF150 is designed to meet the demands of audio electronics system designers by supporting the latest generation decoders, such as Dolby®, THX® and DTS®, among others.

The DSPB56371AF150 is capable of running delay management, bass management and DTS96/24 while using less than half of the DSP's computing capability. This enables designers to add system enhancements that the discerning audio consumer expects. The performance increase is made possible through the use of a higher core frequency, fewer memory wait states, a larger amount of on-chip static random access memory (SRAM) and the addition of an enhanced filter coprocessor (EFCOP). By removing the need for external high-speed SRAM and making smaller, less complex boards, the DSPB56371AF150 is performance-rich and cost-effective.

Features

DSP56K/Symphony Series
Supplied in the 80-LQFP package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
DSPB56371AF150 DSP applications.

  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
  • Image compression
  • Signal processing for telecommunications
  • Control systems
  • Biomedical engineering
  • MP3 audio player
  • Computers and laptop
产品属性
全选
型号系列: DSP56K/Symphony
包装: 散装
部件状态: 在售
类型: 오디오 프로세서
接口: 主机接口,I²C,SAI,SPI
时钟速率: 150MHz
非易失性存储器: ROM(384kB)
片载 RAM: 264kB
输入/输出电压: 3.30V
核心电压: 1.25V
工作温度: 0°C ~ 70°C(TA)
安装类型: 表面贴装型
封装/外壳: 80-LQFP
供应商器件封装: 80-LQFP(14x14)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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