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BUK150-50DL,127

NXP BUK150-50DL,127

通用1不需要20A

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NXP USA Inc.
BUK150-50DL,127
IC PWR DRIVER N-CHAN 1:1 I2PAK
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Overview

The BUK149-50DL,127 is MOSFET N-CH 50V 16A I2PAK, that includes TOPFET? Series, they are designed to operate with a Tube Packaging, Package Case is shown on datasheet note for use in a TO-262-3 Long Leads, I2Pak, TO-262AA, that offers Input Type features such as Non-Inverting, it has an Operating Temperature range of 150°C (TJ), as well as the N-Channel Output Type, the device can also be used as On/Off Interface. In addition, the Supplier Device Package is I2PAK, the device is offered in 1899/12/30 1:01:00 Ratio Input:Output, the device has a 1 of Number of Outputs, and Voltage Supply Vcc Vdd is Not Required, and the Fault Protection is Current Limiting (Fixed), Over Temperature, Over Voltage, and Output Configuration is Low Side, and the Rds On Typ is 36 mOhm, and Voltage Load is 50V (Max), and the Current Output Max is 16A, and Switch Type is General Purpose.

The BUK149-50DL is MOSFET N-CH 50V 16A I2PAK manufactured by NXP. The BUK149-50DL is available in TO-262-3 Long Leads, I²Pak, TO-262AA Package, is part of the PMIC - Power Distribution Switches, Load Drivers, , and with support for MOSFET N-CH 50V 16A I2PAK.

Features

TOPFET™ Series
Tube Package
General Purpose Switch Type
1 Number of Outputs
1:1 Ratio - Input:Output
Low Side Output Configuration
On/Off Interface
50V (Max) Voltage - Load
Not Required Voltage - Supply (Vcc/Vdd)
20A Current - Output (Max)
22mOhm Rds On (Typ)
Current Limiting (Fixed), Over Temperature, Over Voltage Fault Protection
150°C (TJ) Operating Temperature
Through Hole Mounting Type
I2PAK Supplier Device Package
产品属性
全选
型号系列: TOPFET™
包装: 管件
部件状态: 停产
开关类型: 通用
输出数: 1
输入输出比: 1:1
输出配置: 低端
输出类型: N 通道
接口: 开/关
负载电压: 50V(最大)
电源电压(Vcc/Vdd): 不需要
电流 - 输出(最大值): 20A
典型通态电阻: 22 毫欧
输入类型: 非反相
故障保护: 限流(固定),超温,过压
工作温度: 150°C(TJ)
安装类型: 通孔
供应商器件封装: I2PAK
封装/外壳: TO-262-3,长引线,I²Pak,TO-262AA
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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