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BT136-600E/L01,127

NXP BT136-600E/L01,127

逻辑 - 灵敏栅极600 V

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NXP USA Inc.
BT136-600E/L01,127
TRIAC SENS GATE 600V 4A TO220AB
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¥1.78

价格更新:一个月前

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产品详情

Overview

The BT136-600E,127 is TRIAC SENS GATE 600V 4A TO220AB, that includes Tube Packaging, they are designed to operate with a BT136-600E Part Aliases, Unit Weight is shown on datasheet note for use in a 0.211644 oz, that offers Mounting Style features such as Through Hole, Package Case is designed to work in TO-220-3, as well as the Through Hole Mounting Type, the device can also be used as TO-220AB Supplier Device Package. In addition, the Configuration is Single, the device is offered in 15mA Current Hold Ih Max, the device has a 600V of Voltage Off State, and Voltage Gate Trigger Vgt Max is 1.5V, and the Current Gate Trigger Igt Max is 10mA, and Current On State It RMS Max is 4A, and the Current Non Rep# Surge 50 60Hz Itsm is 25A, 27A, and Triac Type is Logic - Sensitive Gate, it has an Maximum Operating Temperature range of + 125 C, and Rated Repetitive Off State Voltage VDRM is 600 V, and the Holding Current Ih Max is 15 mA, and Gate Trigger Voltage Vgt is 0.7 V, and the Gate Trigger Current Igt is 11 mA, and On State RMS Current It RMS is 4 A, and the Non Repetitive On State Current is 27 A, and Off State Leakage Current VDRM IDRM is 0.1 mA, and the On State Voltage is 1.4 V.

BT136-600E with circuit diagram manufactured by NXP. The BT136-600E is available in TO-220 Package, is part of the IC Chips.

Features

Bulk Package
600 V Voltage - Off State
4 A Current - On State (It (RMS)) (Max)
1.5 V Voltage - Gate Trigger (Vgt) (Max)
25A, 27A Current - Non Rep. Surge 50, 60Hz (Itsm)
10 mA Current - Gate Trigger (Igt) (Max)
15 mA Current - Hold (Ih) (Max)
Single Configuration
125°C (TJ) Operating Temperature
Through Hole Mounting Type
产品属性
全选
包装: 散装
部件状态: 在售
三端双向可控硅类型: 逻辑 - 灵敏栅极
离态电压: 600 V
电流 - 开启状态(有效值)(最大值: 4 A
最大栅极触发电压: 1.5 V
电流 - 非重复浪涌 50、60 赫兹(Itsm): 25A,27A
电流 - 栅极触发 (Igt)(最大值): 10 mA
电流 - 保持 (Ih)(最大值): 15 mA
配置: 单路
工作温度: 125°C(TJ)
安装类型: 通孔
包装 / 盒: TO-220-3
供应商 设备封装: TO-220AB
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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