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BSS63,215

NXP BSS63,215

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NXP USA Inc.
BSS63,215
TRANS PNP 100V 100MA SOT23
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¥0.29

价格更新:一个月前

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产品详情

Overview

The BSS63 is TRANS PNP 100V 0.2A SOT23, that includes Digi-ReelR Alternate Packaging Packaging, they are designed to operate with a BSS63_NL Part Aliases, Unit Weight is shown on datasheet note for use in a 0.002116 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in TO-236-3, SC-59, SOT-23-3, as well as the Surface Mount Mounting Type, the device can also be used as SOT-23-3 Supplier Device Package. In addition, the Configuration is Single, the device is offered in 350mW Power Max, the device has a PNP of Transistor Type, and Current Collector Ic Max is 200mA, and the Voltage Collector Emitter Breakdown Max is 100V, and DC Current Gain hFE Min Ic Vce is 30 @ 10mA, 1V, and the Vce Saturation Max Ib Ic is 250mV @ 2.5mA, 25mA, and Current Collector Cutoff Max is 100nA (ICBO), and the Frequency Transition is 50MHz, and Pd Power Dissipation is 350 mW, it has an Maximum Operating Temperature range of + 150 C, it has an Minimum Operating Temperature range of - 55 C, and the Collector Emitter Voltage VCEO Max is 100 V, and Transistor Polarity is PNP, and the Collector Emitter Saturation Voltage is 0.25 V, and Collector Base Voltage VCBO is 110 V, and the Emitter Base Voltage VEBO is 6 V, and Maximum DC Collector Current is 0.2 A, and the Gain Bandwidth Product fT is 50 MHz, and Continuous Collector Current is 0.2 A, and the DC Collector Base Gain hfe Min is 30.

BSS63 E6327 with circuit diagram manufactured by INFINEON. The BSS63 E6327 is available in SOT-23 Package, is part of the IC Chips.

Features

Bulk Package
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包装: 散装
部件状态: 在售
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

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博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

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