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BB131

NXP BB131

1.055pF @ 28V,1MHz1630 V

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NXP USA Inc.
BB131
VARIABLE CAPACITANCE DIODE, VERY
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¥0.16

价格更新:一个月前

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产品详情

Overview

The BB-125.000MBE-T is OSC XO 125.000MHZ LVPECL SMD, that includes BB Series, they are designed to operate with a Standard Clock Oscillators Product, Type is shown on datasheet note for use in a XO (Standard), that offers Packaging features such as Digi-ReelR Alternate Packaging, Termination Style is designed to work in SMD/SMT, as well as the 0.059" (1.50mm) Height, the device can also be used as 7 mm Length. In addition, the Width is 5 mm, the device is offered in 6-SMD, No Lead (DFN, LCC) Package Case, the device has a 125MHz of Frequency, it has an Operating Temperature range of -40°C ~ 85°C, and the Mounting Type is Surface Mount, and Size Dimension is 0.276" L x 0.197" W (7.00mm x 5.00mm), and the Function is Enable/Disable, and Voltage Supply is 3.3V, and the Output is LVPECL, and Current Supply Max is 80mA, and the Frequency Stability is ±50ppm, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 2.5 V 3.3 V, and the Output Format is LVPECL.

BB120-II with circuit diagram, that includes Adapter, Female BNC to Banana (2) Accessory Type, they are designed to operate with a Banana to BNC Adapter Connector Type, Features is shown on datasheet note for use in a Set of 2 Banana to BNC adapters, that offers For Use With Related Products features such as ScopeMeterR 120 Series, Series is designed to work in 120B, as well as the Oscilloscope Type.

Features

Bulk Package
1.055pF @ 28V, 1MHz Capacitance @ Vr, F
16 Capacitance Ratio
C0.5/C28 Capacitance Ratio Condition
30 V Voltage - Peak Reverse (Max)
Single Diode Type
Surface Mount Mounting Type
产品属性
全选
包装: 散装
部件状态: 在售
Vr 时的电容,F: 1.055pF @ 28V,1MHz
电容比: 16
电容比条件: C0.5/C28
最大峰值反向电压: 30 V
二极管类型: 单路
工作温度: -55°C ~ 125°C(TJ)
安装类型: 表面贴装型
封装/外壳: SC-76,SOD-323
供应商器件封装: SOD-323
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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