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ADC1115S125HN/C1:5

NXP ADC1115S125HN/C1:5

11125M1差分,单端2.85V ~ 3.4V,5V1.65V ~ 3.6V-40°C ~ 85°C

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NXP USA Inc.
ADC1115S125HN/C1:5
IC ADC 11BIT PIPELINED 40HVQFN
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¥183.34

价格更新:一个月前

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产品详情

Overview

ADC1113S125HN-C18 with pin details, that includes Tape & Reel (TR) Packaging, they are designed to operate with a 56-VFQFN Exposed Pad Package Case, Input Type is shown on datasheet note for use in a Differential, Single Ended, it has an Operating Temperature range of -40°C ~ 85°C, Supplier Device Package is designed to work in 56-HVQFN (8x8), as well as the 125M Sampling Rate Per Second, the device can also be used as JESD204A Data Interface. In addition, the Number of Bits is 11, the device is offered in 2.85 V ~ 3.4 V Voltage Supply Analog, the device has a 1.65 V ~ 1.95 V of Voltage Supply Digital, and Configuration is S/H-ADC, and the Architecture is Pipelined, and Number of Inputs is 1, and the Reference Type is External, Internal, and Ratio S H:ADC is 1:01, and the Number of A D Converters is 1.

The ADC1115S125/DB,598 is BOARD EVALUATION FOR ADC1115S125, that includes SPI Data Interface, they are designed to operate with a 1 ~ 2 Vpp Input Range, Number of A D Converters is shown on datasheet note for use in a 1, that offers Number of Bits features such as 11, Power Typ Conditions is designed to work in 840mW @ 125MSPS, as well as the 125M Sampling Rate Per Second, the device can also be used as Board, Cable, Power Supply Supplied Contents. In addition, the Utilized IC Part is ADC1115S125.

Features

Tray Package
11 Number of Bits
125M Sampling Rate (Per Second)
1 Number of Inputs
Differential, Single Ended Input Type
1:1 Ratio - S/H:ADC
1 Number of A/D Converters
Pipelined Architecture
External, Internal Reference Type
2.85V ~ 3.4V, 5V Voltage - Supply, Analog
Surface Mount Mounting Type
产品属性
全选
包装: 托盘
部件状态: 停产
位数: 11
每秒采样率: 125M
输入数: 1
输入类型: 差分,单端
数据接口: LVDS - 并行,并行
配置: S/H-ADC
采样和保持与模数转换器的比率: 1:1
模数转换器数量: 1
系统架构: 管线
参考类型: 外部,内部
模拟电源电压: 2.85V ~ 3.4V,5V
数字电源电压: 1.65V ~ 3.6V
工作温度: -40°C ~ 85°C
封装/外壳: 40-VFQFN 裸露焊盘
供应商器件封装: 40-HVQFN(6x6)
安装类型: 表面贴装型
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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