
NXP ADC1115S125/DB,598
111
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Overview
The ADC1113S125HN/C1:5 is IC ADC 125MHZ SOT1152-1, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a 32-VQFN Exposed Pad Package Case, Input Type is shown on datasheet note for use in a Differential, Single Ended, it has an Operating Temperature range of -40°C ~ 85°C, Supplier Device Package is designed to work in 32-HVQFN (7x7), as well as the 125M Sampling Rate Per Second, the device can also be used as JESD204A Data Interface. In addition, the Number of Bits is 11, the device is offered in 2.85 V ~ 3.4 V Voltage Supply Analog, the device has a 1.65 V ~ 1.95 V of Voltage Supply Digital, and Configuration is S/H-ADC, and the Architecture is Pipelined, and Number of Inputs is 1, and the Reference Type is External, Internal, and Ratio S H:ADC is 1:01, and the Number of A D Converters is 1.
The ADC1113S125HN-C1 is IC ADC 11BIT 1CH 125MSPS 32HVQFN, that includes Pipelined Architecture, they are designed to operate with a S/H-ADC Configuration, Data Interface is shown on datasheet note for use in a JESD204A, that offers Input Type features such as Differential, Single Ended, Number of A D Converters is designed to work in 1, as well as the 11 Number of Bits, the device can also be used as 1 Number of Inputs, it has an Operating Temperature range of -40°C ~ 85°C, the device is offered in 56-VFQFN Exposed Pad Package Case, the device has a Tray of Packaging, and Ratio S H:ADC is 1:01, and the Reference Type is External, Internal, and Sampling Rate Per Second is 125M, and the Supplier Device Package is 56-HVQFN (8x8), and Voltage Supply Analog is 2.85 V ~ 3.4 V, and the Voltage Supply Digital is 1.65 V ~ 1.95 V.
Features
Box Package1 Number of A/D Converters
11 Number of Bits
125M Sampling Rate (Per Second)
SPI Data Interface
1 ~ 2Vpp Input Range
840mW @ 125MSPS Power (Typ) @ Conditions
ADC1115S125 Utilized IC / Part
Board(s), Cable(s), Power Supply Supplied Contents
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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