
¥1788.47
价格更新:一个月前博斯克质量保证







Overview
The PIC32MZ2048EFM144T-I/PL is IC MCU 32BIT 2MB FLASH 144LQFP, that includes PICR 32MZ Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 144-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 144-LQFP (20x20), as well as the 120 Number of I O, the device can also be used as 200MHz Speed. In addition, the Core Processor is MIPS32R M-Class, the device is offered in 512K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, and the Connectivity is CAN, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG, and Voltage Supply Vcc Vdd is 2.1 V ~ 3.6 V, and the Core Size is 32-Bit, and Program Memory Size is 2MB (2M x 8), and the Data Converters is A/D 48x12b, and Oscillator Type is Internal.
The PIC32MZ2048EFM144T-I/PH is IC MCU 32BIT 2MB FLASH 144TQFP, that includes CAN, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG Connectivity, they are designed to operate with a MIPS32R M-Class Core Processor, Core Size is shown on datasheet note for use in a 32-Bit, that offers Data Converters features such as A/D 48x12b, Number of I O is designed to work in 120, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 144-TQFP, the device is offered in Tape & Reel (TR) Packaging, the device has a Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT of Peripherals, and Program Memory Size is 2MB (2M x 8), and the Program Memory Type is FLASH, and RAM Size is 512K x 8, and the Series is PICR 32MZ, and Speed is 200MHz, and the Supplier Device Package is 144-TQFP (16x16), and Voltage Supply Vcc Vdd is 2.1 V ~ 3.6 V.
Features
Bulk PackageAudio Type
Microphone Function
Board(s) Contents
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- 包裹重量≤0.5kg的基本运费根据时区和国家而定。
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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博斯克数字
收入: 85M
2022年的收入为8500万美元,与2021年增长63%。
国家: 105
博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
制造商: 950
2022年,博斯克从近950个制造商售卖了配件。
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