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74LVCH1T45GF,132

NXP 74LVCH1T45GF,132

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NXP USA Inc.
74LVCH1T45GF,132
NEXPERIA 74LVCH1T45GF - BUS TRAN
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¥0.86

价格更新:一个月前

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产品详情

Overview

The 74LVCH16T245ZQLR is IC BUS TRANSCVR 16BIT 56BGA, that includes 74LVCH Series, they are designed to operate with a Cut Tape (CT) Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.002056 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 56-VFBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Surface Mount Mounting Type. In addition, the Output Type is Tri-State, Non-Inverted, the device is offered in 56-BGA MICROSTAR JUNIOR (7.0x4.5) Supplier Device Package, the device has a 2 of Number of Circuits, and Data Rate is 500 Mb/s, and the Logic Type is CMOS, and Translator Type is Voltage Level, and the Channel Type is Bidirectional, and Channels per Circuit is 8, and the Voltage VCCA is 1.65 V ~ 5.5 V, and Voltage VCCB is 1.65 V ~ 5.5 V, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Supply Voltage Max is 5.5 V, and Supply Voltage Min is 1.65 V, and the Logic Family is 74LVCH, and Propagation Delay Time is 6 ns.

The 74LVCH16T245DLG4 is IC BUS TRANSCVR 16BIT 48SSOP, that includes 8 Channels per Circuit, they are designed to operate with a Bidirectional Channel Type, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Number of Circuits features such as 2, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Tri-State, Non-Inverted Output Type, the device can also be used as 48-BSSOP (0.295", 7.50mm Width) Package Case. In addition, the Packaging is Tube Alternate Packaging, the device is offered in 74LVCH Series, the device has a 48-SSOP of Supplier Device Package, and Translator Type is Voltage Level, and the Voltage VCCA is 1.65 V ~ 5.5 V, and Voltage VCCB is 1.65 V ~ 5.5 V.

Features

74LVCH Series
Bulk Package
产品属性
全选
型号系列: 74LVCH
包装: 散装
部件状态: 在售
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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