
NXP 74LVCH162374ADGG:5
86.8ns @ 3.3V,50pF1.65V ~ 3.6V
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Overview
The 74LVCH162373APAG8 is IC TRANSP 16BIT D LATCH 48-TSSOP, that includes 74LVCH Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.014850 oz, that offers Package Case features such as 48-TFSOP (0.240", 6.10mm Width), it has an Operating Temperature range of -40°C ~ 85°C, as well as the Surface Mount Mounting Type, the device can also be used as Tri-State Output Type. In addition, the Voltage Supply is 2.7 V ~ 3.6 V, the device is offered in 48-TSSOP Supplier Device Package, the device has a 1899/12/30 8:08:00 of Circuit, and Current Output High Low is 12mA, 12mA, and the Logic Type is D-Type Transparent Latch, and Independent Circuits is 2, and the Delay Time Propagation is 2.1ns, and Part # Aliases is 74LVCH162373A IDT74LVCH162373APAG8.
The 74LVCH162373APVG8 is IC TRANSP 16BIT D LATCH 48-SSOP, that includes 1899/12/30 8:08:00 Circuit, they are designed to operate with a 12mA, 12mA Current Output High Low, Delay Time Propagation is shown on datasheet note for use in a 2.1ns, that offers Independent Circuits features such as 2, Logic Type is designed to work in D-Type Transparent Latch, as well as the Surface Mount Mounting Type, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Output Type is Tri-State, the device is offered in 48-BSSOP (0.295", 7.50mm Width) Package Case, the device has a Digi-ReelR Alternate Packaging of Packaging, and Series is 74LVCH, and the Supplier Device Package is 48-SSOP, and Voltage Supply is 2.7 V ~ 3.6 V.
Features
74LVCH SeriesTape & Reel (TR) Package
Standard Function
2 Number of Elements
8 Number of Bits per Element
330 MHz Clock Frequency
6.8ns @ 3.3V, 50pF Max Propagation Delay @ V, Max CL
Positive Edge Trigger Type
12mA, 12mA Current - Output High, Low
1.65V ~ 3.6V Voltage - Supply
Surface Mount Mounting Type
20 µA Current - Quiescent (Iq)
5 pF Input Capacitance
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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