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74LVC594APW,118

NXP 74LVC594APW,118

8串行至并行,串行1.65V ~ 3.6V

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NXP USA Inc.
74LVC594APW,118
NOW NEXPERIA 74LVC594APW - SERIA
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¥1.80

价格更新:一个月前

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产品详情

Overview

The 74LVC594AD,118 is IC SHIFT REGISTER 8BIT 16-SOIC, that includes 74LVC Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 16-SOIC (0.154", 3.90mm Width), it has an Operating Temperature range of -40°C ~ 125°C, Mounting Type is designed to work in Surface Mount, as well as the Push-Pull Output Type, the device can also be used as Serial to Parallel, Serial Function. In addition, the Voltage Supply is 1.65 V ~ 3.6 V, the device is offered in 16-SO Supplier Device Package, the device has a 1 of Number of Elements, and Logic Type is Shift Register, and the Number of Bits per Element is 8.

The 74LVC594APW,112 is IC SHIFT REGISTER 8BIT 16-TSSOP, that includes Serial to Parallel, Serial Function, they are designed to operate with a Shift Register Logic Type, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Number of Bits per Element features such as 8, Number of Elements is designed to work in 1, it has an Operating Temperature range of -40°C ~ 125°C, the device can also be used as Push-Pull Output Type. In addition, the Package Case is 16-TSSOP (0.173", 4.40mm Width), the device is offered in Tube Alternate Packaging Packaging, the device has a 74LVC of Series, and Supplier Device Package is 16-TSSOP, and the Voltage Supply is 1.65 V ~ 3.6 V.

Features

74LVC Series
Bulk Package
Shift Register Logic Type
1 Number of Elements
8 Number of Bits per Element
Serial to Parallel, Serial Function
1.65V ~ 3.6V Voltage - Supply
Surface Mount Mounting Type
产品属性
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型号系列: 74LVC
包装: 散装
部件状态: 在售
逻辑类型: 移位寄存器
输出类型: 推挽式
元素数量: 1
每个元素的位数: 8
功能: 串行至并行,串行
电源电压: 1.65V ~ 3.6V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装型
包装 / 盒: 16-TSSOP(0.173",4.40mm 宽)
供应商 设备封装: 16-TSSOP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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