
NXP 74LVC3G34GM,125
缓冲器,非反向32mA,32mA1.65V ~ 5.5V
比较






¥0.66
价格更新:一个月前博斯克质量保证







Overview
74LVC3G34DP-Q100H with pin details, that includes 74LVC Series, they are designed to operate with a Tape & Reel (TR) Packaging, Unit Weight is shown on datasheet note for use in a 0.005573 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 8-TSSOP, 8-MSOP (0.118", 3.00mm Width), it has an Operating Temperature range of -40°C ~ 125°C, the device can also be used as Surface Mount Mounting Type. In addition, the Number of Channels is 3, the device is offered in 1.65 V ~ 5.5 V Voltage Supply, the device has a 8-TSSOP of Supplier Device Package, and Number of Elements is 3, and the Current Output High Low is 32mA, 32mA, and Logic Type is Buffer/Line Driver, Non-Inverting, and the Number of Bits per Element is 1, and Pd Power Dissipation is 250 mW, it has an Maximum Operating Temperature range of + 125 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Current is 40 uA, and Supply Voltage Max is 5.5 V, and the Supply Voltage Min is 1.65 V, and Logic Family is 74LVC, and the Propagation Delay Time is 3.8 ns, and Number of Input Lines is 3 Input, and the Number of Output Lines is 3 Output.
The 74LVC3G34GD,125 is IC BUFFER TRPL N-INVERT 8XSON, that includes 32mA, 32mA Current Output High Low, they are designed to operate with a Buffer/Line Driver, Non-Inverting Logic Type, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Number of Bits per Element features such as 1, Number of Elements is designed to work in 3, it has an Operating Temperature range of -40°C ~ 125°C, the device can also be used as 8-XFDFN Package Case. In addition, the Packaging is Digi-ReelR Alternate Packaging, the device is offered in 74LVC Series, the device has a 8-XSON, SOT996-2 (2x3) of Supplier Device Package, and Voltage Supply is 1.65 V ~ 5.5 V.
Features
74LVC SeriesBulk Package
32mA, 32mA Current - Output High, Low
1.65V ~ 5.5V Voltage - Supply
Surface Mount Mounting Type
3 Number of Elements
1 Number of Bits per Element
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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