
NXP 74HC7403N,112
256(64 x 4)30MHz-40°C ~ 125°C
比较






¥26.72
价格更新:一个月前博斯克质量保证







Overview
The 74HC7403D,518 is IC FIFO REGISTER 64X4 16SOIC, that includes 74HC Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 16-SOIC (0.295", 7.50mm Width), it has an Operating Temperature range of -40°C ~ 125°C, Mounting Type is designed to work in Surface Mount, as well as the Asynchronous, Synchronous Function, the device can also be used as 2 V ~ 6 V Voltage Supply. In addition, the Supplier Device Package is 16-SO, the device is offered in 256 (64 x 4) Memory Size, the device has a 30MHz of Data Rate, and Access Time is 49ns, and the Current Supply Max is 1mA, and Bus Directional is Uni-Directional, and the Expansion Type is Depth, Width, and Programmable Flags Support is No, and the Retransmit Capability is No, and FWFT Support is No.
The 74HC7403D,512 is IC FIFO REGISTER 64X4 16SOIC, that includes 49ns Access Time, they are designed to operate with a Uni-Directional Bus Directional, Current Supply Max is shown on datasheet note for use in a 1mA, that offers Data Rate features such as 30MHz, Expansion Type is designed to work in Depth, Width, as well as the Asynchronous, Synchronous Function, the device can also be used as No FWFT Support. In addition, the Memory Size is 256 (64 x 4), the device is offered in Surface Mount Mounting Type, it has an Operating Temperature range of -40°C ~ 125°C, and Package Case is 16-SOIC (0.295", 7.50mm Width), and the Packaging is Tube, and Programmable Flags Support is No, and the Retransmit Capability is No, and Series is 74HC, and the Supplier Device Package is 16-SO, and Voltage Supply is 2 V ~ 6 V.
Features
74HC SeriesTube Package
256 (64 x 4) Memory Size
Asynchronous, Synchronous Function
30MHz Data Rate
49ns Access Time
2 V ~ 6 V Voltage - Supply
1mA Current - Supply (Max)
Depth, Width Expansion Type
No Programmable Flags Support
No Retransmit Capability
No FWFT Support
Through Hole Mounting Type
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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