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74HC194D,653

NXP 74HC194D,653

4通用2V ~ 6V

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NXP USA Inc.
74HC194D,653
NOW NEXPERIA 74HC194D - PARALLEL
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¥2.63

价格更新:一个月前

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产品详情

Overview

The 74HC193PW,118 is IC 4BIT BINARY UP/DN CNT 16TSSOP, that includes 74HC Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 16-TSSOP (0.173", 4.40mm Width), it has an Operating Temperature range of -40°C ~ 125°C, Mounting Type is designed to work in Surface Mount, as well as the Up, Down Direction, the device can also be used as 2 V ~ 6 V Voltage Supply. In addition, the Supplier Device Package is 16-TSSOP, the device is offered in 1 Number of Elements, the device has a Binary Counter of Logic Type, and Number of Bits per Element is 4, and the Reset is Asynchronous, and Timing is Synchronous, and the Count Rate is 49MHz, and Trigger Type is Positive Edge.

The 74HC194D,652 is IC 4BIT BI-DIR SHIFT REG 16SOIC, that includes Universal Function, they are designed to operate with a Register, Bidirectional Logic Type, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Number of Bits per Element features such as 4, Number of Elements is designed to work in 1, it has an Operating Temperature range of -40°C ~ 125°C, the device can also be used as Push-Pull Output Type. In addition, the Package Case is 16-SOIC (0.154", 3.90mm Width), the device is offered in Tube Alternate Packaging Packaging, the device has a 74HC of Series, and Supplier Device Package is 16-SO, and the Voltage Supply is 2 V ~ 6 V.

Features

74HC Series
Bulk Package
Register, Bidirectional Logic Type
1 Number of Elements
4 Number of Bits per Element
Universal Function
2V ~ 6V Voltage - Supply
Surface Mount Mounting Type
产品属性
全选
型号系列: 74HC
包装: 散装
部件状态: 在售
逻辑类型: 双向寄存器
输出类型: 推挽式
元件数: 1
每个元件位数: 4
功能: 通用
电源电压: 2V ~ 6V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装型
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商器件封装: 16-SO
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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