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74ABT573ADB,118

NXP 74ABT573ADB,118

D 型透明锁存器三态4.5V ~ 5.5V

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NXP USA Inc.
74ABT573ADB,118
IC D-TYPE TRANSP SGL 8:8 20SSOP
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产品详情

Overview

The 74ABT573AD,118 is IC OCTAL D TRANSP LATCH 20-SOIC, that includes 74ABT Series, they are designed to operate with a Digi-ReelR Packaging, Package Case is shown on datasheet note for use in a 20-SOIC (0.295", 7.50mm Width), it has an Operating Temperature range of -40°C ~ 85°C, Mounting Type is designed to work in Surface Mount, as well as the Tri-State Output Type, the device can also be used as 4.5 V ~ 5.5 V Voltage Supply. In addition, the Supplier Device Package is 20-SO, the device is offered in 1899/12/30 8:08:00 Circuit, the device has a 32mA, 64mA of Current Output High Low, and Logic Type is D-Type Transparent Latch, and the Independent Circuits is 1, and Delay Time Propagation is 3.3ns.

The 74ABT573AD,112 is IC OCTAL D TRANSP LATCH 20SOIC, that includes 1899/12/30 8:08:00 Circuit, they are designed to operate with a 32mA, 64mA Current Output High Low, Delay Time Propagation is shown on datasheet note for use in a 3.3ns, that offers Independent Circuits features such as 1, Logic Type is designed to work in D-Type Transparent Latch, as well as the Surface Mount Mounting Type, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Output Type is Tri-State, the device is offered in 20-SOIC (0.295", 7.50mm Width) Package Case, the device has a Tube of Packaging, and Series is 74ABT, and the Supplier Device Package is 20-SO, and Voltage Supply is 4.5 V ~ 5.5 V.

Features

74ABT Series
Tape & Reel (TR) Package
8:8 Circuit
4.5V ~ 5.5V Voltage - Supply
1 Independent Circuits
3.3ns Delay Time - Propagation
32mA, 64mA Current - Output High, Low
Surface Mount Mounting Type
产品属性
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型号系列: 74ABT
包装: 卷带(TR)
部件状态: 停产
逻辑类型: D 型透明锁存器
电路: 8:8
输出类型: 三态
电源电压: 4.5V ~ 5.5V
独立电路: 1
传播延迟时间: 3.3ns
电流 - 输出高电平、低电平: 32mA,64mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
包装 / 盒: 20-SSOP(0.209",5.30mm 宽)
供应商 设备封装: 20-SSOP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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