Renesas YWIRELESS-RX111

MCU 32-位RXRX111板

Overview

The NHSC30050RJ is RES CHAS MNT 50 OHM 5% 300W, that includes HS, CGS Series, they are designed to operate with a Tray Packaging, Height is shown on datasheet note for use in a 1.654" (42.00mm), that offers Package Case features such as Axial, Box, it has an Operating Temperature range of -55°C ~ 200°C, as well as the Non-Inductive Features, the device can also be used as 5.039" L x 2.874" W (128.00mm x 73.00mm) Size Dimension. In addition, the Power Watts is 300W, the device is offered in 50 Resistance Ohms, the device has a ±5% of Tolerance, and Temperature Coefficient is ±50ppm/°C, and the Composition is Wirewound, and Coating Housing Type is Aluminum, and the Mounting Feature is Flanges, and Lead Style is Terminal Screw Type.

NHZU18B3TRF-E with EDA / CAD Models manufactured by RENESAS. The NHZU18B3TRF-E is available in SOD323 Package, is part of the IC Chips.

Features

RX Series
Box Package
RX Core Processor
RX111 Utilized IC / Part
Fixed Mounting Type
Board(s) Contents