ON FDZ1416NZ

MOSFET（金属氧化物）2 N 沟道（双）共漏1.3V @ 250µA

Overview

This device is designed specifically as a single package solution for Li-Ion battery pack protection circuit and other ultra-portable applications. It features two common drain N-channel MOSFETs, which enables bidirectional current flow, on an advanced PowerTrench process with state of the art “low pitch” WLCSP packaging process, the FDZ1416NZ minimizes both PCB space and rS1S2(on). This advanced WLCSP MOSFET embodies a breakthrough in packagingtechnology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge and low rS1S2(on).

Features

PowerTrench® Series
Tape & Reel (TR) Package
MOSFET (Metal Oxide) Technology
1.3V @ 250µA Vgs(th) (Max) @ Id
17nC @ 4.5V Gate Charge (Qg) (Max) @ Vgs
500mW Power - Max
Surface Mount Mounting Type

Applications

 

Max rS1S2(on) = 23 mΩ at VGS = 4.5 V, IS1S2 = 1 A

Max rS1S2(on) = 25 mΩ at VGS = 4 V, IS1S2 = 1 A

Max rS1S2(on) = 28 mΩ at VGS = 3.1 V, IS1S2 = 1 A

Max rS1S2(on) = 33 mΩ at VGS = 2.5 V, IS1S2 = 1 A

Occupies only 2.2 mm2 of PCB area

Ultra-thin package: less than 0.35 mm height when mounted to PCB

High power and current handling capability

HBM ESD protection level > 3.2 kV (Note 3)

RoHS Compliant

FDZ1416NZ      Applications

Mobile Handsets

Battery Management

Load Switch

Battery Protection