ON FDZ1323NZ

MOSFET（金属氧化物）逻辑电平门2 N 沟道（双）共漏20V10A13 毫欧 @ 1A，4.5V1.2V @ 250µA

Overview

This device is designed specifically as a single package solution for Li-Ion battery pack protection circuit and other ultra-portable applications. It features two common drain N-channel MOSFETs, which enables bidirectional current flow, on an advanced PowerTrench® process with state of the art“low pitch” WLCSP packaging process, the FDZ1323NZ minimizes both PCB space and rS1S2(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, lowgate charge and low rS1S2(on).

Features

• only takes about 3 mm2 of PCB space.

• When mounted to a PCB, an ultra-thin package has a height of less than 0.35 mm.

• Ability to handle high power and current

• 3.6 kV or above for HBM ESD protection (Note 3)

• REACH Compliant

Applications

• Battery administration

• Charge switch

• Battery security