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BFR30LT1

ON BFR30LT1

TO-236-3,SC-59,SOT-23-3

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onsemi
BFR30LT1
JFET N-CH SOT23-3
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¥0.48

价格更新:一个月前

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产品详情

Overview

The BFR30,235 is JFET N-CH 10MA 250MW SOT23, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a TO-236-3, SC-59, SOT-23-3 Package Case, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Supplier Device Package features such as SOT-23 (TO-236AB), FET Type is designed to work in N-Channel, as well as the 250mW Power Max, the device can also be used as 25V Drain to Source Voltage Vdss. In addition, the Current Drain Idss Vds Vgs=0 is 4mA @ 10V, the device is offered in 10mA Current Drain Id Max, the device has a 5V @ 0.5nA of Voltage Cutoff VGS off Id, and Input Capacitance Ciss Vds is 4pF @ 10V.

BFR30 with circuit diagram manufactured by NXP. The BFR30 is available in SOT-23 Package, is part of the IC Chips.

Features

25 V Drain to Source Voltage (Vdss)


·Pb-Free Package is Available

 


Surface Mount Mounting Type

Applications

Memory Termination Requlator for DDRDDR2

DDR3.DDR3Land DDR4 VTT Termination

Low-Voltage Applications for 1-V to 6-VInput Rails


产品属性
全选
包装: 卷带(TR)
部件状态: 停产
FET 类型: N 通道
漏源电压(Vdss): 25 V
不同 Vds (Vgs=0) 时电流 - 漏极 (Idss): 4 mA @ 10 V
栅极-源极关态电压和漏极电流时的截止电压: 5 V @ 0.5 nA
Vds 时的最大输入电容 (Ciss): 5pF @ 10V
最大功率: 225 mW
工作温度: -55°C ~ 150°C(TJ)
安装类型: 表面贴装型
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商器件封装: SOT-23-3(TO-236)
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