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XCKU5P-2FFVB676I

Xilinx XCKU5P-2FFVB676I

47460041984000280

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Xilinx
XCKU5P-2FFVB676I
IC FPGA 280 I/O 676FCBGA
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¥422.75

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The Xilinx Kintex UltraScale+ FPGAs are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. The -2LE and -1LI devices can operate at a VCCINT voltage at 0.85V or 0.72V and provide lower maximum static power. When operated at VCCINT = 0.85V, using -2LE and -1LI devices, the speed specification for the L devices is the same as the -2I or -1I speed grades. When operated at VCCINT = 0.72V, the -2LE and -1LI performance and static and dynamic power is reduced. DC and AC characteristics are specified in extended (E), industrial (I), and military (M) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade extended device are the same as for a -1 speed grade industrial device). However, only selected speed grades and/or devices are available in each temperature range.

Kintex UltraScale+™ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance peripherals and cost-effective system implementation. Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.

Features

Kintex® UltraScale+™ Series
280 I/Os
Up to 41984000 RAM bits

Surface Mount Mounting Type

Applications


There are a lot of Xilinx Inc.
XCKU5P-2FFVB676I FPGAs applications.

  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
产品属性
全选
型号系列: Kintex® UltraScale+™
包装: 托盘
部件状态: 在售
可编程: 未验证
逻辑阵列块/可配置逻辑块数量: 27120
逻辑元件/单元数: 474600
总 RAM 位数: 41984000
输入/输出数量: 280
电源电压: 0.825V ~ 0.876V
安装类型: 表面贴装型
工作温度: -40°C ~ 100°C(TJ)
封装/外壳: 676-BBGA,FCBGA
供应商器件封装: 676-FCBGA(27x27)
Xilinx

Xilinx

Xilinx是一家领先的半导体公司,专注于开发和提供现场可编程门阵列(FPGA)、复杂可编程逻辑器件(CPLD)以及相关设计工具。成立于1984年,总部位于美国加利福尼亚州圣何塞。Xilinx是全球首个商业可行FPGA的发明者,并创造了无晶圆厂(fabless)制造模式。2020年,Xilinx被AMD收购,成为其高性能计算和自适应计算解决方案的重要组成部分。

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收入: 85M

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配件发货: 25M+

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