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XA7Z030-1FBV484Q

Xilinx XA7Z030-1FBV484Q

MCU,FPGA带 CoreSight™ 的双核 ARM® Cortex®-A9 MPCore™256KBDMACANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG667MHz

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Xilinx
XA7Z030-1FBV484Q
IC SOC CORTEX-A9 667MHZ 484FCBGA
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¥1710.00

价格更新:一个月前

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产品详情

Overview

The XA Zynq-7000 family offers the flexibility and scalability of an FPGA, while providing the performance, power, and ease of use typically associated with ASICs and ASSPs. The range of devices in the XA Zynq-7000 SoC family allows designers to target cost-sensitive as well as high-performance applications from a single platform using industry-standard tools. While each device in the XA Zynq-7000 family contains the same PS, the PL and I/O resources vary between the devices. 

The XA Zynq™-7000 Automotive family is based on the Xilinx® All Programmable SoC architecture. These products integrate a feature-rich dual-core ARM® Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces. This highly integrated, flexible, and power-optimized solution is ideal for high computationally intensive and performance demanding applications. The automotive family focuses on automotive applications and consists of the Z-7010, Z-7020, and Z-7030 devices.

Features

Tray Package
MCU, FPGA Architecture
256KB RAM Size
DMA Peripherals
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Connectivity
667MHz Speed
产品属性
全选
型号系列: Automotive, AEC-Q100, Zynq®-7000 XA
包装: 托盘
部件状态: 在售
系统架构: MCU,FPGA
核心处理器: 带 CoreSight™ 的双核 ARM® Cortex®-A9 MPCore™
RAM 大小: 256KB
外设: DMA
连接能力: CANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
速度: 667MHz
主要属性: Kintex™-7 FPGA,125K 逻辑单元
工作温度: -40°C ~ 125°C(TJ)
封装/外壳: 484-BBGA,FCBGA
供应商器件封装: 484-FCBGA(23x23)
Xilinx

Xilinx

Xilinx是一家领先的半导体公司,专注于开发和提供现场可编程门阵列(FPGA)、复杂可编程逻辑器件(CPLD)以及相关设计工具。成立于1984年,总部位于美国加利福尼亚州圣何塞。Xilinx是全球首个商业可行FPGA的发明者,并创造了无晶圆厂(fabless)制造模式。2020年,Xilinx被AMD收购,成为其高性能计算和自适应计算解决方案的重要组成部分。

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