Winbond W29N01HWDINF

128M×825纳秒-40°C ~ 85°C (TA)

Overview

W29N01HVDINA with pin details, that includes Tray Packaging, they are designed to operate with a 48-VFBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA), that offers Interface features such as Parallel, Voltage Supply is designed to work in 2.7 V ~ 3.6 V, as well as the 48-VFBGA (8x6.5) Supplier Device Package, the device can also be used as 1G (128M x 8) Memory Size. In addition, the Memory Type is FLASH - NAND (SLC), the device is offered in 25ns Speed, the device has a FLASH of Format Memory.

W29N01HVBINF with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 1G (128M x 8), that offers Memory Type features such as FLASH - NAND (SLC), it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 63-VFBGA Package Case, the device can also be used as Tray Packaging. In addition, the Speed is 25ns, the device is offered in 63-VFBGA (9x11) Supplier Device Package, the device has a 2.7 V ~ 3.6 V of Voltage Supply.

Features

Tray Package
FLASH Memory Format
1Gbit Memory Size
128M x 8 Memory Organization
Parallel Memory Interface
25ns Write Cycle Time - Word, Page
25 ns Access Time
1.7V ~ 1.95V Voltage - Supply
Surface Mount Mounting Type