联系我们
中文
W25Q80EWSNIG

Winbond W25Q80EWSNIG

1M×8-40°C ~ 85°C (TA)

比较
W25Q80EWSNIG
IC FLASH 8MBIT SPI/QUAD 8SOIC
paypalvisamastercarddiscover
upsdhlsf
比较

¥1.52

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

W25Q80DVZPIG TR with pin details, that includes SpiFlashR Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 8-WDFN Exposed Pad, it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in SPI Serial, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 8-WSON (6x5) Supplier Device Package. In addition, the Memory Size is 8M (1M x 8), the device is offered in FLASH - NOR Memory Type, the device has a 104MHz of Speed, and Format Memory is FLASH.

W25Q80DVUXIE TR with EDA / CAD Models, that includes Tape & Reel (TR) Packaging, they are designed to operate with a SpiFlashR Series, Interface is shown on datasheet note for use in a SPI Serial, that offers Memory Type features such as FLASH - NOR, Format Memory is designed to work in FLASH, as well as the 8-USON (2x3) Supplier Device Package, the device can also be used as 8-UFDFN Exposed Pad Package Case. In addition, the Memory Size is 8M (1M x 8), it has an Operating Temperature range of -40°C ~ 85°C (TA), the device has a 2.7 V ~ 3.6 V of Voltage Supply, and Speed is 104MHz.

Features

SpiFlash® Series
Package / Case: 8-SOIC (0.154, 3.90mm Width)

Surface Mount Mounting Type

Applications


There are a lot of Winbond Electronics
W25Q80EWSNIG Memory applications.

  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
产品属性
全选
型号系列: SpiFlash®
包装: 管子
部件状态: 在售
可编程: 未经审核的
存储器类型: 非挥发性
存储器格式: 闪光
技术: 闪存 - NOR
存储容量: 8兆比特
存储器组织: 1M×8
存储器接口: SPI - 四路 I/O、QPI
时钟频率: 104兆赫
单词、页面的写入周期时间: 800微秒
电源电压: 1.65V~1.95V
工作温度: -40°C ~ 85°C (TA)
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154 英寸,3.90 毫米宽)
供应商器件封装: 8-SOIC
Winbond Electronics

Winbond Electronics

Winbond Electronics是一家全球知名的半导体公司,专注于存储器解决方案的设计和制造。公司成立于1987年,总部位于台湾新竹科学园区。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z