Winbond W25Q40CLSNIG

512K×8-40°C ~ 85°C (TA)

Overview

W25Q40BWZPIG TR with pin details, that includes SpiFlashR Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 8-WDFN Exposed Pad, it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in SPI Serial, as well as the 1.65 V ~ 1.95 V Voltage Supply, the device can also be used as 8-WSON (6x5) Supplier Device Package. In addition, the Memory Size is 4M (512K x 8), the device is offered in FLASH - NOR Memory Type, the device has a 80MHz of Speed, and Format Memory is FLASH.

W25Q40CLSIP with EDA / CAD Models manufactured by WINBOND. The W25Q40CLSIP is available in BGA Package, is part of the IC Chips.

Features

SpiFlash® Series
Package / Case: 8-SOIC (0.154, 3.90mm Width)
8 Pins

Surface Mount Mounting Type

Applications

There are a lot of Winbond Electronics
W25Q40CLSNIG Memory applications.

• Cache memory
• cell phones
• eSRAM
• mainframes
• multimedia computers
• networking
• personal computers
• servers
• supercomputers
• telecommunications