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W25Q32JVZPIQ

Winbond W25Q32JVZPIQ

4M×8-40°C ~ 85°C (TA)

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W25Q32JVZPIQ
IC FLASH 32MBIT SPI/QUAD 8WSON
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¥0.91

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

W25Q32JVSTIQ TR with pin details, that includes SpiFlashR Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 8-SOIC (0.209", 5.30mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in SPI Serial, as well as the 1.65 V ~ 1.95 V Voltage Supply, the device can also be used as 8-VSOP Supplier Device Package. In addition, the Memory Size is 32M (4M x 8), the device is offered in FLASH - NOR Memory Type, the device has a 104MHz of Speed, and Format Memory is FLASH.

W25Q32JVTCIQ TR with EDA / CAD Models, that includes Tape & Reel (TR) Packaging, they are designed to operate with a SpiFlashR Series, Interface is shown on datasheet note for use in a SPI Serial, that offers Memory Type features such as FLASH - NOR, Format Memory is designed to work in FLASH, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as 32M (4M x 8) Memory Size. In addition, the Supplier Device Package is 24-TFBGA (6x8), the device is offered in 24-TBGA Package Case, the device has a 104MHz of Speed, and Voltage Supply is 1.65 V ~ 1.95 V.

Features

SpiFlash® Series
Package / Case: 8-WDFN Exposed Pad
Additional Feature:2.7V NOMINAL AVAILABLE WITH 104MHZ

Surface Mount Mounting Type

Applications


There are a lot of Winbond Electronics
W25Q32JVZPIQ Memory applications.

  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
  • hard disk drive (HDD)
产品属性
全选
型号系列: SpiFlash®
包装: 管子
部件状态: 在售
可编程: 未经审核的
存储器类型: 非挥发性
存储器格式: 闪光
技术: 闪存 - NOR
存储容量: 32兆比特
存储器组织: 4M×8
存储器接口: SPI - 四路 I/O
时钟频率: 133兆赫
单词、页面的写入周期时间: 3毫秒
电源电压: 2.7V~3.6V
工作温度: -40°C ~ 85°C (TA)
安装类型: 表面贴装
封装/外壳: 8-WDFN 裸露焊盘
供应商器件封装: 8-WSON (6x5)
Winbond Electronics

Winbond Electronics

Winbond Electronics是一家全球知名的半导体公司,专注于存储器解决方案的设计和制造。公司成立于1987年,总部位于台湾新竹科学园区。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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