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BAL-UWB-01E3

ST BAL-UWB-01E3

3GHz ~ 8GHz50 / 100 欧姆1.2dB

比较
BAL-UWB-01E3
BALUN FOR UWB 3HGZ TO 8GHZ
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¥1.49

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The 970-009-030R121 is BACKSHELL DB9 DIE CAST NICKEL, that includes Silver Color, they are designed to operate with a Metal, Zinc Material, Accessory Type is shown on datasheet note for use in a Two Piece Backshell, that offers Series features such as 970, ARMOR, Type is designed to work in Strain Relief Backshell, as well as the Bulk Packaging, the device can also be used as ARMOR Tradename. In addition, the Flammability Rating is UL 94 V-0, the device is offered in Mating Screws 4-40, Sealed Features, the device has a Nickel over Copper of Shell Plating, and Number of Positions is 9, and the Shielding is Shielded, and Cable Exit is 180°, and the Plating is Nickel over Copper, and Cable Type is Round, and the Hardware is Assembly Hardware, Grommets, and Shell Material is Zinc Die Cast, and the Cable Entry Angle is Straight, and Number of Cable Entries is 1 Entry.

The 970-009-030-121 is BACKSHELL DB9 DIE CAST NICKEL, that includes Two Piece Backshell Accessory Type, they are designed to operate with a Silver Color, Shielding is shown on datasheet note for use in a Shielded, that offers Cable Type features such as Round, Plating is designed to work in Nickel over Copper, as well as the Metal, Zinc Material, the device can also be used as Mating Screws 4-40 Features. In addition, the Hardware is Assembly Hardware, Grommets, the device is offered in 970 Series, the device has a 9 of Number of Positions, and Cable Exit is 180°.

Features

Tape & Reel (TR) Package
3GHz ~ 8GHz Frequency Range
50 / 100Ohm Impedance - Unbalanced/Balanced
1.2dB Insertion Loss (Max)
12dB Return Loss (Min)
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
频率范围: 3GHz ~ 8GHz
非平衡/平衡阻抗: 50 / 100 欧姆
最大插入损耗: 1.2dB
最小回波损耗: 12dB
封装/外壳: 6-SMD,无引线
安装类型: 表面贴装型
STMicroelectronics

STMicroelectronics

STMicroelectronics(ST)是一家领先的半导体公司,成立于1987年,总部位于瑞士日内瓦。公司提供多种半导体解决方案,应用于汽车、工业、个人电子和通信等领域。ST的产品组合包括微控制器、传感器、模拟IC和电源管理芯片等。

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