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S29GL01GS12DHIV20A

Spansion S29GL01GS12DHIV20A

64M x 16120 ns-40°C ~ 85°C(TA)

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Spansion
S29GL01GS12DHIV20A
IC FLASH 1GBIT PARALLEL 64FBGA
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产品详情

Overview

The S29GL01GS12DHIV10 is IC FLASH 1GBIT 120NS 64FBGA, that includes GL-S Series, they are designed to operate with a Tray Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, it has an Operating Temperature Range range of - 40 C to + 85 C, Package Case is designed to work in 64-LBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Parallel Interface. In addition, the Voltage Supply is 1.65 V ~ 3.6 V, the device is offered in 64-FBGA (9x9) Supplier Device Package, the device has a 1G (64M x 16) of Memory Size, and Memory Type is FLASH - NOR, and the Speed is 120ns, and Architecture is Eclipse, and the Format Memory is FLASH, and Interface Type is Parallel, and the Organization is 64 M x 16, and Supply Current Max is 100 mA, and the Data Bus Width is 16 bit, and Supply Voltage Max is 3.6 V, and the Supply Voltage Min is 2.7 V, and Timing Type is Asynchronous.

S29GL01GS11WEI029 with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 1G (64M x 16), that offers Memory Type features such as FLASH - NOR, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Die Package Case, the device can also be used as Bulk Packaging. In addition, the Series is GL-S, the device is offered in 110ns Speed, the device has a Wafer of Supplier Device Package, and Voltage Supply is 2.7 V ~ 3.6 V.

Features

Bulk Package
FLASH Memory Format
1Gbit Memory Size
64M x 16 Memory Organization
Parallel Memory Interface
60ns Write Cycle Time - Word, Page
120 ns Access Time
1.65V ~ 3.6V Voltage - Supply
Surface Mount Mounting Type
产品属性
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型号系列: GL-S
包装: 散装
部件状态: 在售
可编程: 未验证
存储器类型: 非易失
存储器格式: 闪存
技术: FLASH - NOR
存储容量: 1Gb
存储器组织: 64M x 16
存储器接口: 并联
单词、页面的写入周期时间: 60ns
访问时间: 120 ns
电源电压: 1.65V ~ 3.6V
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 64-LBGA
供应商器件封装: 64-FBGA(9x9)
Spansion

Spansion

Spansion是一家专注于嵌入式闪存解决方案的半导体公司,成立于2003年,由AMD和富士通的闪存业务合并而成。2015年,Spansion被Cypress Semiconductor收购。

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