Skyworks 65723-11-EVB

放大器1.559GHz ~ 1.606GHzSKY65723-11

Overview

The 24-6571-16 is CONN IC DIP SOCKET ZIF 24POS, that includes 57 Series, they are designed to operate with a DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Closed Frame Features, the device can also be used as Polyphenylene Sulfide (PPS), Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 24 (2 x 12), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Nickel Boron of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Nickel Boron, and Contact Finish Thickness Mating is 50μin (1.27μm), and the Contact Material Mating is Beryllium Nickel, and Contact Finish Thickness Post is 50μin (1.27μm), and the Contact Material Post is Beryllium Nickel.

The 24-6572-10 is CONN IC DIP SOCKET ZIF 24POS TIN, that includes Tin Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 200μin (5.08μm), that offers Contact Finish Thickness Post features such as 200μin (5.08μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Beryllium Copper Contact Material Post, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 24 (2 x 12) of Number of Positions or Pins Grid, and Packaging is Bulk, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Series is 57, and Termination is Solder, and the Type is DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing.

Features

Bulk Package
Amplifier Type
1.559GHz ~ 1.606GHz Frequency
Board(s) Supplied Contents