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CL05A106MP5NRNC

Samsung CL05A106MP5NRNC

10 µF±20%10V

比较
CL05A106MP5NRNC
CAP CER 10UF 10V X5R 0402
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比较

¥0.29

价格更新:一个月前

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产品详情

Overview

CL05A105MQ3LNNC with pin details, that includes CL Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 0402 (1005 Metric), that offers Capacitance features such as 1μF, it has an Operating Temperature range of -55°C ~ 85°C, as well as the Surface Mount, MLCC Mounting Type, the device can also be used as 6.3V Voltage Rated. In addition, the Size Dimension is 0.039" L x 0.020" W (1.00mm x 0.50mm), the device is offered in General Purpose Applications, the device has a ±20% of Tolerance, and Temperature Coefficient is X5R, and the Thickness Max is 0.013" (0.33mm).

CL05A105MQ5NNND with EDA / CAD Models, that includes X5R Temperature Coefficient, they are designed to operate with a Tape & Reel (TR) Packaging, Mounting Type is shown on datasheet note for use in a Surface Mount, MLCC, that offers Applications features such as General Purpose, Series is designed to work in CL, as well as the 6.3V Voltage Rated, it has an Operating Temperature range of -55°C ~ 85°C. In addition, the Capacitance is 1μF, the device is offered in 0402 (1005 Metric) Package Case, the device has a 0.039" L x 0.020" W (1.00mm x 0.50mm) of Size Dimension, and Thickness Max is 0.022" (0.55mm), and the Tolerance is ±20%.

Features

CL Series
Tape & Reel (TR) Package
10 µF Capacitance
±20% Tolerance
10V Voltage - Rated
X5R Temperature Coefficient
General Purpose Applications
Surface Mount, MLCC Mounting Type
0402 (1005 Metric) Package / Case
0.039" L x 0.020" W (1.00mm x 0.50mm) Size / Dimension
0.026" (0.65mm) Thickness (Max)
产品属性
全选
型号系列: CL
包装: 卷带(TR)
部件状态: 在售
电容: 10 µF
容差: ±20%
额定电压: 10V
温度系数: X5R
工作温度: -55°C ~ 85°C
使用案例: 通用
安装类型: 表面贴装,MLCC
封装/外壳: 0402(1005 公制)
尺寸/尺寸: 0.039" 长 x 0.020" 宽(1.00mm x 0.50mm)
最大厚度: 0.026"(0.65mm)
Samsung Electro-Mechanics

Samsung Electro-Mechanics

Samsung Electro-Mechanics是一家专注于电子元器件的公司,成立于1973年,总部位于韩国水原市。公司提供多种电子元器件,包括多层陶瓷电容器、印刷电路板、相机模块等

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