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BC57H687C-GITM-E4

Qualcomm BC57H687C-GITM-E4

Bluetooth v2.1 +EDR, Class 2 and 32.4GHz5dBm

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Qualcomm
BC57H687C-GITM-E4
IC RF TXRX+MCU BLUTOOTH 120LFBGA
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¥49.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The BC57G687C-INN-E4 is IC RF TXRX+MCU BLUTOOTH 105LFBGA, that includes BlueCoreR Series, they are designed to operate with a TxRx + MCU Type, Packaging is shown on datasheet note for use in a Digi-ReelR Alternate Packaging, that offers Package Case features such as 105-LFBGA, Frequency is designed to work in 2.4GHz, it has an Operating Temperature range of -30°C ~ 85°C, the device can also be used as -90dBm Sensitivity. In addition, the Voltage Supply is 1.8 V ~ 3.6 V, the device is offered in 16MB Flash, 48kB RAM Memory Size, the device has a Bluetooth v2.1 +EDR, Class 2 and 3 of Protocol, and Power Output is 5dBm, and the Current Receiving is 45mA, and RF Family Standard is Bluetooth, and the GPIO is , and Current Transmitting is 45mA.

BC57G687CU with circuit diagram manufactured by CSR. The BC57G687CU is available in BGA Package, is part of the IC Chips.

Features

BlueCore® Series
120-LFBGA package
TxRx + MCU
Tape & Reel (TR) is used
120 pins
BlueCore® series

Surface Mount Mounting Type

Applications


There are a lot of Qualcomm
BC57H687C-GITM-E4 RF Transceiver ICs applications.

  • M2M Communication
  • Remote Device Management
  • Low-power IoT applications
  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
  • Transmit
  • Receive
  • Switch
  • Power management
产品属性
全选
型号系列: BlueCore®
包装: 卷带(TR)
部件状态: 不适用于新设计
类型: TxRx + MCU
射频系列/标准: 蓝牙
协议: Bluetooth v2.1 +EDR, Class 2 and 3
频率: 2.4GHz
输出功率: 5dBm
灵敏度: -90dBm
存储容量: 8MB 闪存
电源电压: 1.8V ~ 3.6V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 120-LFBGA
供应商器件封装: 120-LFBGA (7x7)
可编程: 未验证
Qualcomm

Qualcomm

Qualcomm 是全球无线技术创新的领导者,推动5G、物联网和人工智能的发展。其Snapdragon处理器以卓越的性能和效率著称,广泛应用于许多旗舰智能手机中。Qualcomm 的技术不仅在移动通信领域具有重要地位,还在汽车、计算、网络和工业应用中扮演关键角色。

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