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MC9S08DN16ACLC

NXP Semiconductors MC9S08DN16ACLC

HCS0840MHz16KB(16K x 8)

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MC9S08DN16ACLC
IC MCU 8BIT 16KB FLASH 32LQFP
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产品详情

Overview

The MC9S08AW60VFGE is IC MCU 8BIT 60KB FLASH 44LQFP, that includes S08 Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.012561 oz, that offers Package Case features such as 44-LQFP, it has an Operating Temperature range of -40°C ~ 105°C (TA), as well as the 44-LQFP (10x10) Supplier Device Package, the device can also be used as 34 Number of I O. In addition, the Speed is 40MHz, the device is offered in S08 Core Processor, the device has a 2K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is I2C, SCI, SPI, and the Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and Core Size is 8-Bit, and the Program Memory Size is 60KB (60K x 8), and Data Converters is A/D 8x10b, and the Oscillator Type is Internal, and Core is S08, and the Processor Series is MC9S08, and Data Bus Width is 8 bit.

MC9S08CDZ60MLC with circuit diagram manufactured by FREESCALE. The MC9S08CDZ60MLC is available in QFP48 Package, is part of the IC Chips.

Features

S08 Series
32-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC9S08DN16ACLC Microcontroller applications.

  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
产品属性
全选
型号系列: S08
包装: 散装
部件状态: 停产
可编程: 未验证
核心处理器: HCS08
内核规格: 8 位
速度: 40MHz
连接能力: I²C,LINbus,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 26
程序存储容量: 16KB(16K x 8)
程序存储器类型: 闪存
EEPROM 容量: 512 x 8
RAM 大小: 1K x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 10x12b SAR
振荡器类型: 外部,内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 32-LQFP
供应商器件封装: 32-LQFP(7x7)
NXP Semiconductors

NXP Semiconductors

NXP Semiconductors是一家领先的半导体公司,专注于为汽车、工业物联网、移动和通信基础设施市场提供安全连接解决方案。公司总部位于荷兰埃因霍温,成立于2006年,前身是飞利浦半导体部门。NXP通过创新的半导体技术,推动智能世界的发展,使设备能够安全地感知、思考、连接和行动

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