联系我们
中文
74AHCT1G125GM,115

NXP Semiconductors 74AHCT1G125GM,115

缓冲器,非反向8mA,8mA4.5V ~ 5.5V

比较
74AHCT1G125GM,115
IC BUFFER NON-INVERT 5.5V 6XSON
paypalvisamastercarddiscover
upsdhlsf
比较

¥0.49

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The 74AHCT1G125DCKTG4 is IC BUS BUFF/DVR TRI-ST SC70-5, that includes 74AHCT Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 5-TSSOP, SC-70-5, SOT-353, it has an Operating Temperature range of -40°C ~ 85°C, Mounting Type is designed to work in Surface Mount, as well as the 4.5 V ~ 5.5 V Voltage Supply, the device can also be used as SC-70-5 Supplier Device Package. In addition, the Number of Elements is 1, the device is offered in 8mA, 8mA Current Output High Low, the device has a Buffer/Line Driver, Non-Inverting of Logic Type, and Number of Bits per Element is 1.

The 74AHCT1G125DRLRG4 is IC BUS BUFF/DVR TRI-ST SOT5, that includes 8mA, 8mA Current Output High Low, they are designed to operate with a Buffer/Line Driver, Non-Inverting Logic Type, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Number of Bits per Element features such as 1, Number of Elements is designed to work in 1, it has an Operating Temperature range of -40°C ~ 85°C, the device can also be used as SOT-553 Package Case. In addition, the Packaging is Tape & Reel (TR), the device is offered in 74AHCT Series, the device has a SOT-5 of Supplier Device Package, and Voltage Supply is 4.5 V ~ 5.5 V.

Features

74AHCT Series
Bulk Package
8mA, 8mA Current - Output High, Low
4.5V ~ 5.5V Voltage - Supply
Surface Mount Mounting Type
1 Number of Elements
1 Number of Bits per Element
产品属性
全选
型号系列: 74AHCT
包装: 散装
部件状态: 在售
逻辑类型: 缓冲器,非反向
电流 - 输出高、低: 8mA,8mA
电源电压: 4.5V ~ 5.5V
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 6-XFDFN
供应商器件封装: 6-XSON (1.45x1)
元件数: 1
每个元件位数: 1
输出类型: 三态
NXP Semiconductors

NXP Semiconductors

NXP Semiconductors是一家领先的半导体公司,专注于为汽车、工业物联网、移动和通信基础设施市场提供安全连接解决方案。公司总部位于荷兰埃因霍温,成立于2006年,前身是飞利浦半导体部门。NXP通过创新的半导体技术,推动智能世界的发展,使设备能够安全地感知、思考、连接和行动

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z